XCVU190-2FLGC2104E

The XCVU190-2FLGC2104E is a Virtex® UltraScale™ field programmable gate array (FPGA) IC from AMD. It provides a high-capacity programmable fabric combined with substantial on-chip memory and a large I/O complement for dense system designs.

This extended-grade, surface-mount FPGA is suited to designs that require significant logic resources, embedded memory, and flexible I/O integration within a 2104-FCBGA package.

Key Features

• Core Logic  Approximately 2,349,900 logic elements to implement large-scale digital designs and complex custom logic.
• Embedded Memory  Approximately 151 Mbits of on-chip RAM for buffering, lookup tables, and data storage close to logic.
• I/O Capacity  416 I/O pins to support broad external connectivity and multiple parallel interfaces.
• Package & Mounting  2104-BBGA / 2104-FCBGA package (2104-FCBGA (47.5×47.5)) in a surface-mount form factor for compact board integration.
• Power Supply  Operates with a core voltage supply range of 922 mV to 979 mV.
• Temperature & Grade  Extended grade operation across 0 °C to 100 °C, providing a defined thermal operating window for system design.
• Regulatory  RoHS compliant.

Typical Applications

• High-density logic designs  Deploy large custom logic blocks and state machines using the device’s extensive logic element count.
• Memory-intensive processing  Leverage approximately 151 Mbits of embedded RAM for buffering, data staging, and on-chip storage.
• High I/O interfacing  Use 416 I/Os to connect multiple peripherals, sensors, or parallel interfaces directly to the FPGA fabric.
• Compact system integration  The 2104-FCBGA surface-mount package supports dense PCB layouts where board space is at a premium.

Unique Advantages

• High logic density:  Approximately 2.35 million logic elements enable implementation of complex, large-scale designs without immediate external logic.
• Substantial on-chip RAM:  Roughly 151 Mbits of embedded memory reduce dependence on external memory for many buffering and data management tasks.
• Large I/O footprint:  416 I/Os simplify system interfaces and reduce the need for additional bridging components.
• Compact FCBGA package:  2104-FCBGA packaging allows for high-density board designs while maintaining extensive functionality.
• Defined operating envelope:  Extended grade rating with a 0 °C to 100 °C operating range and specified core voltage range for predictable system-level power design.
• RoHS compliance:  Meets environmental substance requirements for easier regulatory integration.

Why Choose XCVU190-2FLGC2104E?

The XCVU190-2FLGC2104E delivers a balance of large programmable logic capacity, significant embedded memory, and ample I/O in a compact surface-mount FCBGA package. Its extended-grade rating and clearly specified supply and thermal ranges make it a practical choice for engineering teams building systems that require high integration and predictable operating conditions.

This part is suited to designs that demand scale in logic and memory resources while maintaining a compact board footprint, and it benefits from the Virtex® UltraScale™ architecture naming and manufacturer backing indicated on the product.

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