XCVU19P-1FSVA3824E

The XCVU19P-1FSVA3824E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD. It delivers a very large programmable fabric with 8,937,600 logic elements and approximately 79.6 Mbits of embedded memory, combined with a high I/O count for dense system integration.

This device is targeted at designs that require substantial on-chip logic and memory capacity alongside high I/O density. Its package and electrical characteristics support surface-mount integration into complex boards where a compact, high-capacity FPGA is required.

Key Features

• Core Logic Capacity – 8,937,600 logic elements provide a very large programmable fabric for complex digital designs.
• Configurable Logic Blocks (CLBs) – 510,720 CLBs enable partitioning of the programmable fabric across large designs.
• Embedded Memory – Approximately 79.6 Mbits of on-chip RAM for buffering, caching, and local data storage.
• I/O Density – 2,072 device I/Os support extensive external connectivity and high pin-count interfaces.
• Package & Mounting – 3824-FCBGA (65×65) package, surface-mount mounting type, suitable for compact board-level integration.
• Power Supply – Specified operating supply voltage range of 825 mV to 876 mV for core domains.
• Temperature & Grade – Extended grade with an operating temperature range of 0 °C to 100 °C.
• Environmental Compliance – RoHS compliant.

Typical Applications

• High-capacity digital systems – For designs requiring millions of logic elements and large on-chip memory to implement complex, high-density logic.
• System prototypes and integration – Useful where extensive programmable fabric and high I/O counts are needed to validate and integrate multi-module systems.
• Data buffering and local storage – The approximately 79.6 Mbits of embedded RAM supports applications that need significant on-chip data storage.

Unique Advantages

• Large programmable fabric: Enables implementation of extensive custom logic functions without external glue logic.
• High I/O count: 2,072 I/Os reduce the need for additional I/O expanders and simplify board-level connectivity.
• Significant on-chip memory: Approximately 79.6 Mbits of RAM supports on-chip buffering and reduces dependence on external memory in many designs.
• Compact, surface-mount FCBGA: 3824-FCBGA (65×65) package provides a high-density solution for space-constrained boards.
• Predictable power domain: Narrow core voltage range (825 mV–876 mV) aids in power supply planning and thermal budgeting.
• Extended operating range: 0 °C to 100 °C grade for applications requiring extended temperature operation.

Why Choose XCVU19P-1FSVA3824E?

The XCVU19P-1FSVA3824E positions itself as a high-capacity, highly integrated FPGA solution for designs that demand large numbers of logic elements, substantial embedded memory, and very high I/O density. Its FCBGA package and surface-mount mounting facilitate compact board-level implementations where integration density matters.

This AMD Virtex® UltraScale+™ device is suited for engineering teams and procurement looking for a scalable programmable platform that consolidates logic, memory, and I/O in a single IC while meeting extended-grade temperature requirements and RoHS compliance.

Request a quote or submit an inquiry to evaluate XCVU19P-1FSVA3824E for your next high-density FPGA design.