XCVU11P-2FLGC2104E

The XCVU11P-2FLGC2104E is a Virtex® UltraScale+™ field programmable gate array (FPGA) in a 2104-ball FCBGA package designed for demanding, high-bandwidth systems. Built on the UltraScale+ architecture, this device targets applications requiring large programmable logic capacity, substantial on-chip memory and extensive I/O bandwidth.

Typical use cases include data center packet processing, wired communications and waveform processing where high performance-per-watt, system integration and large embedded memory are key design drivers.

Key Features

• Architecture  Based on the Virtex UltraScale+ architecture, delivering the family-level advantages of improved performance-per-watt and architectural enhancements described for UltraScale+ devices.
• Logic Capacity  Approximately 2,835,000 logic elements (logic cells) to implement large, complex digital designs.
• Embedded Memory  Approximately 396 Mbits of embedded memory for buffering, on-chip data storage and memory-intensive algorithms.
• I/O and Package  Up to 416 user I/O in a 2104-BBGA / 2104-FCBGA package (47.5 × 47.5 mm) with surface-mount mounting for high-density board integration.
• Power and Voltage  Core supply operating range from 825 mV to 876 mV to support voltage-scaled performance and power trade-offs.
• Operating Range and Grade  Extended grade device specified for 0 °C to 100 °C operation.
• Compliance  RoHS compliant.
• Design Ecosystem (Series-Level)  UltraScale+ devices are co-optimized with the Vivado® Design Suite and leverage UltraFAST™ design methodology for accelerated time to market (series-level capability).

Typical Applications

• Data Center Networking  High-capacity packet processing and custom offload functions that benefit from abundant logic and embedded memory.
• Wired Communications  Line-card and switching applications that require large I/O counts and flexible protocol implementation.
• Waveform Processing  Real-time signal processing and algorithm acceleration using high logic density and on-chip RAM for intermediate data buffering.
• High-Bandwidth Systems  Systems requiring tight integration of logic, memory and high I/O bandwidth to handle multi-gigabit data flows.

Unique Advantages

• Large Programmable Capacity: Approximately 2.8M logic elements enable complex, high-density designs and system consolidation.
• Substantial On-Chip Memory: Approximately 396 Mbits of embedded RAM reduces external memory dependence and lowers system latency for buffer- and cache-heavy tasks.
• High I/O Count in Compact Package: 416 I/O in a 2104-FCBGA (47.5×47.5 mm) package facilitates dense board-level integration while supporting extensive external connectivity.
• Voltage-Scaled Core: Core supply specified between 825 mV and 876 mV supports design trade-offs between performance and power consumption.
• Extended Temperature Grade: Rated for 0 °C to 100 °C operation to meet a range of commercial and extended-environment applications.
• Design Flow Support (Series-Level): Architecture-level compatibility with Vivado design tools and UltraFAST methodology helps accelerate development and integration.

Why Choose XCVU11P-2FLGC2104E?

The XCVU11P-2FLGC2104E delivers a combination of high logic capacity, substantial on-chip memory and a large number of I/Os in a compact FCBGA package, making it suitable for designs that need to consolidate functions and handle heavy data throughput. Its UltraScale+ architecture heritage provides architecture-level benefits such as improved performance-per-watt and toolchain integration to help reduce development time.

This device is well suited for system architects and engineers building high-bandwidth networking, communications and signal-processing platforms who require scalable programmable logic, integrated memory resources and dense I/O in an extended-grade package.

Request a quote or submit an inquiry to get pricing, availability and additional technical support for the XCVU11P-2FLGC2104E.