XCVU095-3FFVA2104E

The XCVU095-3FFVA2104E is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) from AMD. It delivers a high density of programmable logic and on-chip memory in a 2104-FCBGA package (47.5 × 47.5 mm) intended for complex digital system integration.

With approximately 1,176,000 logic elements, roughly 62 Mbits of embedded memory, and 832 I/O, this device is targeted at designs that require substantial logic capacity, significant embedded memory, and extensive external connectivity while operating within an extended-grade thermal range.

Key Features

• Logic Fabric  Approximately 1,176,000 logic elements provide large programmable logic capacity for complex RTL, datapaths, and custom accelerators.
• Configurable Logic Blocks  Includes 67,200 CLBs to structure and organize logic resources across the device.
• Embedded Memory  Approximately 62 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without relying solely on external memory.
• I/O Resources  832 I/O pins offer broad external interfacing options for parallel buses, high pin-count peripherals, and system interconnects.
• Package & Mounting  2104-BBGA / 2104-FCBGA package (47.5 × 47.5 mm) in a surface-mount form factor for dense board-level integration.
• Core Voltage Range  Nominal core supply range of 970 mV to 1.03 V, enabling defined power delivery planning for the FPGA core.
• Operating Environment  Extended-grade device rated for 0 °C to 100 °C operation to match higher ambient thermal conditions in many systems.
• Manufacturer  Designed and supplied by AMD, leveraging the Virtex UltraScale family architecture.

Typical Applications

• High-density FPGA systems  For designs that require a very large number of logic elements and CLBs to implement complex custom logic and large datapaths.
• I/O-intensive designs  Suitable where a high I/O count (832 pins) is needed to connect multiple peripherals, external memories, or board-level interconnects.
• Embedded memory-dependent designs  Useful for applications that benefit from approximately 62 Mbits of embedded RAM for buffering, state machines, and on-chip data storage.

Unique Advantages

• Large programmable capacity: The device’s roughly 1,176,000 logic elements reduce the need for multi-device partitioning in high-complexity designs.
• Substantial on-chip memory: Approximately 62 Mbits of embedded RAM enables significant on-chip buffering and reduces dependence on external memory bandwidth.
• High I/O count: 832 I/O pins provide flexibility for complex board-level connectivity and diverse interface requirements.
• Compact, high-density package: The 2104-FCBGA (47.5 × 47.5 mm) package supports dense integration while maintaining surface-mount assembly compatibility.
• Defined power and thermal envelope: Clear core voltage range (970 mV–1.03 V) and extended operating temperature (0 °C–100 °C) allow targeted system power and thermal planning.

Why Choose XCVU095-3FFVA2104E?

The XCVU095-3FFVA2104E combines very large programmable logic capacity, substantial on-chip RAM, and a high I/O count in a single extended-grade FCBGA package from AMD’s Virtex UltraScale family. These characteristics make it well suited for designers addressing complex, high-density digital implementations where consolidation of logic and memory resources on-chip is a priority.

Customers designing systems that demand sizable logic resources, extensive interfacing, and clear power/thermal parameters will find this device appropriate for reducing board complexity and supporting scalable designs over the product lifecycle.

Request a quote or submit an inquiry to receive pricing and availability information for the XCVU095-3FFVA2104E.