XCVU095-2FFVC1517I

The XCVU095-2FFVC1517I is a Virtex® UltraScale™ field programmable gate array (FPGA) IC from AMD, supplied in a 1517-FCBGA surface-mount package. It provides high logic density, abundant embedded memory, and a large I/O count for designs that require significant on-chip resources.

With 1,176,000 logic elements, approximately 62.26 Mbits of embedded memory, and 520 I/O, this industrial-grade device targets complex digital designs that demand integration, scalable logic capacity, and extended operating conditions.

Key Features

• Core Logic  1,176,000 logic elements for implementing large-scale digital functions and custom compute blocks.
• Embedded Memory  Approximately 62.26 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive algorithms.
• I/O Capacity  520 I/O pins to accommodate wide peripheral connectivity and multi-channel interfaces.
• Power  Voltage supply operating range of 922 mV to 979 mV for core power domains.
• Package & Mounting  1517-BBGA / 1517-FCBGA (40×40) package in a surface-mount form factor for board-level integration.
• Operating Range  Industrial-grade operating temperature from −40 °C to 100 °C, suitable for extended-temperature applications.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital signal processing  Use the large logic element count and substantial embedded memory to implement complex DSP pipelines and custom accelerators.
• Network and packet processing  High I/O count and on-chip RAM make the device suitable for multi-channel networking logic and packet buffering.
• Data center and compute acceleration  Leverage the FPGA’s scale of logic and memory to prototype or deploy hardware accelerators and offload compute tasks.
• Industrial control and automation  Industrial-grade temperature range and flexible I/O support robust control, monitoring, and sensor interface implementations.

Unique Advantages

• Highly integrated logic capacity: 1,176,000 logic elements reduce the need for external glue logic and enable consolidation of multiple functions on a single device.
• Substantial on-chip memory: Approximately 62.26 Mbits of embedded RAM supports large buffering and stateful processing without external memory.
• Large I/O complement: 520 I/O pins provide flexibility for parallel interfaces, high-channel counts, and diverse connectivity options.
• Industrial temperature support: Rated from −40 °C to 100 °C for deployment in environments requiring extended thermal margins.
• Compact surface-mount package: 1517-FCBGA (40×40) form factor enables high-density board integration while maintaining manageability for assembly.

Why Choose XCVU095-2FFVC1517I?

The XCVU095-2FFVC1517I positions itself as a high-capacity FPGA option when substantial on-chip logic, memory, and I/O are required in industrial-temperature applications. Its combination of 1,176,000 logic elements, approximately 62.26 Mbits of embedded memory, and 520 I/Os provides designers with a platform to consolidate complex digital functions and reduce external component count.

This device is well suited for engineers building compute- and I/O-intensive systems that benefit from a single, scalable FPGA solution in a 1517-FCBGA surface-mount package and operating across a wide temperature and core voltage range.

Request a quote or submit an inquiry for pricing and availability of the XCVU095-2FFVC1517I to discuss fit for your next design.