XCVU095-2FFVB2104E

The XCVU095-2FFVB2104E is a Virtex® UltraScale™ field programmable gate array (FPGA) IC by AMD, supplied in a 2104-FCBGA (47.5×47.5) surface-mount package. It is an extended-grade device designed to offer very large programmable logic capacity and on-chip memory for complex digital designs.

Key on-chip resources include 1,176,000 logic elements, approximately 62.26 Mbits of embedded memory, and 702 I/O pins. The device operates from a supply range of 922 mV to 979 mV and is specified for an operating temperature range of 0 °C to 100 °C.

Key Features

• High Logic Capacity Contains 1,176,000 logic elements to implement large-scale programmable logic and complex custom architectures.
• Embedded Memory Approximately 62.26 Mbits of on-chip RAM to support large buffering, lookup tables, and memory-intensive functions without external DRAM.
• High I/O Count 702 general-purpose I/O pins for extensive interfacing to peripherals, high-pin-count connectors, or multi-channel I/O subsystems.
• Package and Mounting 2104-FCBGA (47.5×47.5) package in a surface-mount Ball Grid Array format for compact, high-density board layouts.
• Extended Temperature Grade Rated for operation from 0 °C to 100 °C to meet applications requiring extended commercial temperature range.
• Supply Voltage Range Core supply specified between 922 mV and 979 mV for integration with regulated power rail designs.

Typical Applications

• High-density programmable logic designs — Implement large-scale logic fabrics and complex custom processing pipelines using the device's 1,176,000 logic elements.
• Memory-intensive functions — Use approximately 62.26 Mbits of embedded RAM for buffering, packet processing, or on-chip data storage without relying solely on external memory.
• High I/O systems — Leverage 702 I/Os for multi-channel data acquisition, interface aggregation, or dense connector-based systems.

Unique Advantages

• Massive programmable capacity: 1,176,000 logic elements provide the headroom to consolidate multiple functions into a single device, reducing component count.
• Significant on-chip RAM: Approximately 62.26 Mbits of embedded memory minimizes external memory dependence and simplifies board-level memory design.
• Extensive I/O surface: 702 I/Os enable broad connectivity options for sensors, high-speed interfaces, and peripherals without immediate need for external multiplexing.
• Compact, high-density package: 2104-FCBGA (47.5×47.5) allows integration into space-constrained PCBs while maintaining a high pin count.
• Extended-grade rating: Specified for 0 °C to 100 °C operation to support designs requiring extended commercial temperature performance.
• Defined core supply range: Core voltage specified between 922 mV and 979 mV to support predictable power-supply planning and regulator selection.

Why Choose XCVU095-2FFVB2104E?

The XCVU095-2FFVB2104E positions itself as a high-capacity Virtex UltraScale FPGA suited for designs that require very large logic resources, substantial embedded memory, and a high count of I/Os in a compact FCBGA footprint. Its extended-grade rating and defined supply/temperature parameters allow engineers to plan thermal and power subsystems with specific device limits in mind.

This device is appropriate for teams consolidating multiple functions into a single programmable device where on-chip memory and high I/O density are critical. Selecting the XCVU095-2FFVB2104E provides a scalable platform within the Virtex UltraScale family from AMD for complex digital implementations.

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