XCVU095-2FFVB1760E

The XCVU095-2FFVB1760E is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 1760-FCBGA surface-mount package. It delivers high logic capacity, substantial embedded memory, and a large I/O count for demanding programmable-logic designs.

This device is well suited to applications that require large numbers of logic elements, significant on-chip RAM, and extensive I/O connectivity, while operating within an extended grade temperature range and a defined core voltage window.

Key Features

• Core Logic 1,176,000 logic elements and 67,200 CLBs provide a high-density programmable fabric for complex logic implementations.
• Embedded Memory Approximately 62.26 Mbits of on-chip RAM to support memory-intensive algorithms and buffering within the FPGA.
• I/O Capacity 702 available I/O pins to support high-channel-count interfaces and broad system connectivity.
• Package and Mounting 1760-FCBGA (1760-BBGA) package, supplier package size 42.5 × 42.5 mm, designed for surface-mount PCB assembly.
• Power Core voltage supply specified from 922 mV to 979 mV, enabling predictable power design around the device’s operating range.
• Operating Range and Grade Extended grade device with an operating temperature range of 0 °C to 100 °C suitable for a broad set of production environments.
• RoHS Compliance RoHS compliant indicating conformance with standard lead-free environmental requirements.

Typical Applications

• High-density FPGA compute — Leverage the large logic element count and CLBs for complex algorithm implementation and parallel processing tasks.
• Memory-intensive processing — Use the approximately 62.26 Mbits of embedded RAM for buffering, lookup tables, and on-chip data storage.
• High I/O interface systems — Support multi-channel data acquisition, communication gateways, or I/O-rich control systems with 702 I/O pins.
• Board-level integration — The 1760-FCBGA package and surface-mount mounting suit compact, high-density PCB designs.

Unique Advantages

• High logic capacity: 1,176,000 logic elements enable implementation of large, multi-function designs on a single device, reducing the need for multiple FPGAs.
• Substantial on-chip memory: Approximately 62.26 Mbits of embedded RAM supports data-heavy workloads without constant external memory access.
• Extensive I/O: 702 I/O pins provide flexibility for connecting numerous peripherals, sensors, or high-speed interfaces.
• Compact FCBGA package: 1760-FCBGA (42.5 × 42.5 mm) balances high integration with a PCB-friendly form factor for production assemblies.
• Defined power envelope: A specified core voltage range of 922 mV to 979 mV aids in reliable power-supply design and validation.
• Extended grade operation: Rated for 0 °C to 100 °C operation, offering suitability across a variety of production environments.

Why Choose XCVU095-2FFVB1760E?

The XCVU095-2FFVB1760E positions itself as a high-capacity Virtex® UltraScale™ FPGA option for designers who need substantial logic resources, abundant on-chip RAM, and a large I/O complement in a production-ready FCBGA package. Its defined voltage and temperature specifications support predictable system integration and deployment.

This device is appropriate for teams building complex, scalable FPGA-based systems where integration density, on-chip memory, and I/O flexibility reduce overall system complexity and BOM count while supporting robust production use.

Request a quote or submit an inquiry to receive pricing and availability information for the XCVU095-2FFVB1760E.