XCVU095-2FFVA2104I

The XCVU095-2FFVA2104I is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC in a 2104-FCBGA package designed for high-density, industrial-grade digital designs. It combines a large pool of logic resources, substantial on-chip memory, and extensive I/O to support complex implementation requirements.

With industrial temperature grading and a defined core voltage range, this device is suited to designs that require predictable electrical and thermal operating envelopes while maximizing logic and memory resources on a single FCBGA package.

Key Features

• Logic Resources  Approximately 1,176,000 logic elements and 67,200 CLBs provide a high-capacity fabric for large-scale logic integration and complex datapaths.
• Embedded Memory  Approximately 62.26 Mbits of on-chip RAM to implement buffers, FIFOs, and memory-intensive logic functions without external memory.
• I/O Density  Up to 832 user I/O pins to support wide parallel interfaces and numerous peripheral connections.
• Package  2104-FCBGA package (2104-BBGA/FCBGA form) with a supplier device package dimension of 47.5×47.5 mm for high pin-count, compact board integration.
• Power  Defined core supply range from 922 mV to 979 mV to match system power delivery design and regulation requirements.
• Temperature Range  Industrial operating range from −40 °C to 100 °C for deployment in thermally demanding environments.
• Mounting  Surface mount device suitable for modern PCB assembly processes.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital systems  Leverage the large logic element count and abundant on-chip RAM to implement complex control and signal processing functions in compact designs.
• Interface aggregation and bridging  Use the extensive I/O count to connect and manage multiple parallel interfaces or heterogeneous peripherals on a single FPGA platform.
• Industrial control and automation  Industrial-grade temperature range and robust packaging support deployment in factory and process-control equipment requiring sustained operation over a wide thermal window.

Unique Advantages

• High logic and CLB capacity: The combination of 1,176,000 logic elements and 67,200 CLBs enables consolidation of multiple functions into one device, reducing system complexity.
• Significant on-chip memory: Approximately 62.26 Mbits of embedded RAM reduces dependence on external memory, lowering BOM and improving throughput for memory-centric tasks.
• Extensive I/O count: 832 I/O pins provide flexibility for wide buses, multi-channel interfaces, and dense connector schemes.
• Industrial operating range: Rated from −40 °C to 100 °C to meet temperature requirements for industrial deployments.
• Compact, high-pin-count package: 2104-FCBGA (47.5×47.5 mm) offers a high pin density in a footprint suitable for space-constrained boards.
• Controlled core voltage window: A specified core supply range (922 mV–979 mV) helps align power-supply design and regulation choices.

Why Choose XCVU095-2FFVA2104I?

The XCVU095-2FFVA2104I positions itself as a high-capacity FPGA option for designs that require a balance of extensive logic, sizable embedded memory, and broad I/O capability in an industrial-grade package. Its combination of resources supports consolidation of complex systems onto a single programmable device, aiding board-level simplification and design integration.

This device is ideal for engineers and system designers targeting high-density digital implementations in industrial applications that need predictable operating ranges and defined power requirements. Choosing this FPGA provides a scalable foundation for designs that prioritize on-chip resources and I/O flexibility.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the XCVU095-2FFVA2104I and to discuss your application requirements with a product specialist.