XCVU095-2FFVB2104I

The XCVU095-2FFVB2104I is an AMD Virtex® UltraScale™ Field Programmable Gate Array (FPGA) supplied in a 2104-FCBGA package. It delivers high logic capacity and on-chip memory with a large I/O count, suited for designs that require dense programmable logic, substantial embedded RAM, and broad external connectivity.

With industrial-grade operating range and a defined supply voltage window, this device is targeted at systems that need reliable operation across extended temperatures and tight power rails.

Key Features

• Core Capacity Approximately 1,176,000 logic elements to implement large-scale programmable logic and complex digital functions.
• Embedded Memory Approximately 62.26 Mbits of on-chip RAM to support buffering, packet queues, frame storage, and other memory-intensive functions.
• High I/O Count 702 I/Os for broad external connectivity and interfacing with multiple peripherals, transceivers, and daughter cards.
• Package 2104-FCBGA (47.5×47.5 mm) package, listed as 2104-BBGA, FCBGA, enabling high-density board-level integration.
• Power Specified core voltage supply range from 922 mV to 979 mV for defined power budgeting and supply design.
• Temperature & Mounting Industrial operating temperature range of −40°C to 100°C and surface-mount package for standard PCB assembly processes.
• Compliance RoHS compliant, meeting lead-free and hazardous-substance requirements.

Typical Applications

• High-density logic systems — Use the device’s 1,176,000 logic elements to implement complex state machines, custom accelerators, and large combinational/sequential logic blocks.
• Memory-intensive processing — Leverage approximately 62.26 Mbits of embedded RAM for packet buffering, video frame staging, and real-time data buffering.
• Connectivity and bridging — 702 I/Os provide flexibility for multi-protocol interfacing, bridging between legacy and high-speed peripherals, and dense mezzanine connections.
• Industrial control and automation — Industrial temperature rating and robust packaging make it suitable for factory automation, motor control interfaces, and process control systems.

Unique Advantages

• High logic density: 1,176,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level complexity.
• Substantial on-chip memory: Approximately 62.26 Mbits of RAM supports large buffers and low-latency data handling without external memory.
• Extensive I/O resources: 702 I/Os simplify system partitioning and minimize the need for external multiplexing or expanders.
• Industrial temperature capability: −40°C to 100°C operation supports deployment in demanding environmental conditions.
• Compact, high-density package: 2104-FCBGA (47.5×47.5 mm) enables dense integration on multi-layer PCBs while supporting a large pin count.
• RoHS compliant: Meets regulatory requirements for lead-free and hazardous-substance control.

Why Choose XCVU095-2FFVB2104I?

The XCVU095-2FFVB2104I positions itself for designs that demand a combination of high logic capacity, ample embedded memory, and broad I/O capability within an industrial temperature envelope. Its defined supply voltage range and surface-mount FCBGA package support predictable system-level power and board integration.

This device is well suited for engineering teams building high-density, memory-forward systems that require reliable operation across varied environments and a compact board footprint. It offers scalability and integration potential for complex FPGA-based subsystems.

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