XCVU095-2FFVC2104E

The XCVU095-2FFVC2104E is a Virtex® UltraScale™ FPGA from AMD provided in a 2104-BBGA FCBGA package. It delivers a high-density programmable logic fabric with substantial on-chip memory and a large complement of I/O for complex digital designs.

Designed for surface-mount applications, this device supports an extended temperature grade and operates from a core supply range of 922 mV to 979 mV, making it suitable for demanding board-level implementations that require a compact, high-capacity programmable device.

Key Features

• Programmable Logic Capacity — 1,176,000 logic elements provide significant capacity for large-scale logic integration and parallel processing architectures.
• Embedded Memory — Approximately 62.26 Mbits of on-chip RAM enable extensive buffering, lookup tables, and data storage directly within the FPGA fabric.
• I/O Resources — 416 I/O pins support broad connectivity options for high-pin-count system designs and multiple peripheral interfaces.
• Power and Supply — Operates with a core supply range of 922 mV to 979 mV, allowing designers to plan power delivery and sequencing around a defined voltage window.
• Package and Mounting — Supplied in a 2104-FCBGA package (47.5 × 47.5 mm) for surface-mount assembly, enabling dense board-level integration.
• Operating Range and Grade — Extended grade device specified for an ambient operating range of 0 °C to 100 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Telecommunications — High logic density and large embedded memory support data-path implementations and protocol handling where on-chip resources reduce external component needs.
• Data Center and Acceleration — Dense logic and abundant I/O make the device suitable for hardware acceleration, algorithm implementation, and platform-level integration.
• High-Performance Computing — Large on-chip RAM and significant logic capacity enable complex compute kernels and custom processing pipelines within a single FPGA package.

Unique Advantages

• High Logic Density: 1,176,000 logic elements allow consolidation of large designs into one device, simplifying board layout and interconnect complexity.
• Substantial Embedded Memory: Approximately 62.26 Mbits of on-chip RAM reduce dependence on external memory for buffering and table storage.
• Ample I/O Count: 416 I/Os provide flexibility for connecting multiple interfaces, sensors, and high-pin-count subsystems directly to the FPGA.
• Compact FCBGA Packaging: The 2104-FCBGA (47.5 × 47.5 mm) package supports high-density PCB integration while maintaining a large resource set.
• Defined Supply Window: Core operation within 922 mV to 979 mV allows predictable power design and voltage planning.
• Extended Temperature Grade: Rated for 0 °C to 100 °C operation to meet a range of board- and system-level thermal environments.

Why Choose XCVU095-2FFVC2104E?

The XCVU095-2FFVC2104E positions itself as a high-capacity Virtex® UltraScale™ FPGA option combining over a million logic elements, tens of megabits of embedded RAM, and hundreds of I/Os in a single 2104-FCBGA package. Its specified supply range and extended operating temperature make it appropriate for complex, high-density designs that require substantial on-chip resources.

This device is well suited to designers and teams developing large-scale digital systems that demand integrated memory and extensive I/O without partitioning functionality across multiple devices. The combination of programmable logic, memory, and package density supports scalable designs and streamlined board integration.

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