UUB1A101MCL1GS

The UUB1A101MCL1GS is a chip-type aluminum electrolytic capacitor in the Nichicon UUB series designed for high-temperature operation. It is a surface-mount, tape-fed component optimized for automated assembly and long-term performance in elevated-temperature environments.

This part delivers 100 µF capacitance at 10 V with polarization, a compact 6.2 × 8 mm can-style SMD footprint, and an operating temperature range of -40 °C to +125 °C, making it suitable for applications that require robust temperature endurance and AEC-Q200 qualification.

Key Features

• Electrical Performance — 100 µF rated capacitance at 10 V with ±20% tolerance; polarized design for DC applications.
• Temperature and Endurance — Rated for operation from -40 °C to +125 °C with a specified lifetime of 1000 hours at 125 °C for the φ8 × 6.2 size.
• Ripple Current Capability — Supports 58 mA ripple current at 120 Hz and 87 mA at 10 kHz, suitable for decoupling and filtering in moderate ripple environments.
• Dissipation and Leakage — Tangent of loss angle (tan δ) max 0.32 at 120 Hz, 20 °C for 10 V rating; leakage current after 1 minute at 20 °C is specified as not more than 0.03·C·V (μA) for the applicable voltage range.
• Package & Mounting — Radial can SMD package (chip type) with part dimensions L: 6.2 × D: 8 mm and recommended land pattern L: 8.3 × W: 8.3 mm; designed for carrier-tape feeding and automatic placement.
• Solderability and Robustness — Meets resistance-to-soldering-heat requirements: hot-plate condition at 250 °C for 30 seconds with specified post-test electrical characteristics.
• Qualification & Compliance — AEC-Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863), supporting reliability and regulatory needs.

Typical Applications

• Automotive systems — Suitable for automotive electronic modules that require AEC-Q200 qualification and stable operation up to +125 °C.
• High-temperature electronics — Designed for electronic assemblies and power circuits operating in elevated-temperature environments where extended endurance at 125 °C is required.
• Automated surface-mount production — Chip-type, tape-fed configuration enables efficient use in high-volume automated placement for compact SMD assemblies.

Unique Advantages

• High-temperature endurance: Rated lifetime of 1000 hours at 125 °C for the φ8 × 6.2 size, supporting long-term operation in hot environments.
• AEC-Q200 qualification: Delivers an industry-recognized reliability baseline for demanding applications.
• Automated assembly friendly: Carrier-tape fed chip design and SMD can package streamline pick-and-place integration and help reduce board-level assembly time.
• Compact footprint: 6.2 × 8 mm package with a defined land pattern (8.3 × 8.3 mm) supports dense PCB layouts without sacrificing capacitance.
• Measurable ripple handling: Specified ripple current ratings (58 mA at 120 Hz, 87 mA at 10 kHz) allow designers to size components against real ripple loads.
• Soldering robustness: Meets solder heat resistance testing at 250 °C for 30 seconds, easing reflow and assembly process qualification.

Why Choose UUB1A101MCL1GS?

The UUB1A101MCL1GS positions itself as a reliable, high-temperature-capable SMD electrolytic capacitor for designs that demand both thermal endurance and automated assembly compatibility. With AEC-Q200 qualification, a compact chip-type package, and defined ripple and leakage specifications, it suits engineers designing for harsh thermal environments and production-scale surface-mount workflows.

This part is well matched to engineers and procurement teams seeking a verified, RoHS-compliant capacitor option that balances capacitance, size, and high-temperature reliability while supporting standard assembly processes.

Request a quote or contact sales to discuss pricing, availability, and how UUB1A101MCL1GS can fit into your next high-temperature or automotive-capable design.