UUB1C221MNL1GS
| Part Description |
220 µF 16 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,927 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UUB |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive, High Temperature Reflow | Capacitance | 220 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 1.05 cm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 125°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -40°C - 125°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 153 mA @ 10 kHz | Ripple Current Low Frequency | 102 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 10 x 10 mm | Surface Mount Land Size | 10.3 x 10.3 mm | ||
| Tolerance | -20%~20% | Voltage | 16 V |
Overview of UUB1C221MNL1GS – Chip Type Aluminum Electrolytic Capacitor, 220 µF, 16 V, 125 °C
The UUB1C221MNL1GS is a chip-type aluminum electrolytic capacitor designed for surface-mount assembly. It provides 220 µF capacitance at a 16 V rating and is optimized for high-temperature environments up to +125 °C.
Its construction supports automatic mounting from carrier tape and AEC-Q200 qualification, making it suitable for high-reliability applications that require compact bulk capacitance and stable performance under elevated temperatures.
Key Features
- Capacitance and Voltage: 220 µF rated capacitance at 16 V for bulk smoothing and energy storage in low-voltage power rails.
- High Temperature Operation: Rated for operation from −40 °C to +125 °C with a specified endurance of 2000 hours at 125 °C.
- Reliability & Qualification: AEC-Q200 qualified and RoHS compliant, supporting use in designs that require automotive-grade reliability and environmental compliance.
- Surface-Mount Chip Package: Chip-type, radial can SMD package designed for automated mounting from carrier tape, with a recommended land size of 1.03 × 1.03 cm for PCB layout.
- Low Leakage & Stability: Leakage current at 20 °C after 1 minute is specified as ≤ 0.03 × C × V (µA) for 10–50 V ratings, and tan δ at 16 V is specified (max. 0.24), supporting predictable impedance and loss characteristics.
- Ripple Handling: Specified ripple current of 102 mA at 120 Hz and 153 mA at 10 kHz for handling AC ripple on DC rails.
- Tolerance & Temperature Behavior: Capacitance tolerance ±20% and low-temperature impedance behavior characterized down to −40 °C (impedance ratio Z(−40 °C)/Z(+20 °C) = 8 for 16 V rating).
Typical Applications
- Automotive Electronics: Bulk smoothing and decoupling in control modules and power supplies where AEC-Q200 qualification and high-temperature endurance are required.
- Industrial Power Supplies: Energy storage and ripple filtering on low-voltage rails subjected to elevated ambient temperatures.
- Telecommunications & Networking: Power rail stabilization in compact SMD designs that require reliable performance under continuous load and temperature stress.
- Embedded & Control Systems: Local energy storage and decoupling for DC-DC converters and microcontroller power domains in high-reliability assemblies.
Unique Advantages
- High-temperature endurance: Rated for operation up to +125 °C with 2000 hours endurance at that temperature, enabling deployment in thermally demanding environments.
- Automated assembly ready: Chip-type SMD format compatible with carrier-tape feed for streamlined pick-and-place processes and higher PCB assembly throughput.
- AEC-Q200 qualification: Qualification provides an added level of assurance for reliability-focused designs requiring industry-recognized stress screening.
- Predictable electrical behavior: Defined leakage current, tan δ, and low-temperature impedance characteristics help simplify design margining and power integrity analysis.
- Compact, board-friendly footprint: SMD radial can construction with defined PCB land size supports compact power designs and consistent board layout implementation.
- Environmental compliance: RoHS compliant for designs targeting regulatory and customer environmental requirements.
Why Choose UUB1C221MNL1GS?
UUB1C221MNL1GS combines a high-capacitance 220 µF value with a 16 V rating in a chip-type SMD package engineered for high-temperature operation and automated assembly. Its AEC-Q200 qualification and defined electrical characteristics make it a strong choice for engineers building reliable power systems that must withstand elevated temperatures and continuous ripple loading.
This part is well suited to designers of automotive, industrial, and telecommunications equipment who need compact bulk capacitance, predictable leakage and loss behavior, and qualification-backed reliability for long-term deployment.
Request a quote or submit an inquiry to receive pricing and availability for UUB1C221MNL1GS and to discuss how it can fit your design requirements.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016