UUD0J101MCL1GS

The UUD0J101MCL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor in a surface‑mount radial can (φ6.3×5.8 mm). It delivers 100 µF capacitance at a 6.3 V rating and is supplied in embossed carrier taping for automated placement.

Designed for high‑density PCBs and qualified to AEC‑Q200, this RoHS‑compliant part targets automotive and other robust electronics requiring compact SMD decoupling, filtering and bulk energy storage across a wide temperature range (−55°C to +105°C).

Key Features

• Capacitance & Voltage — 100 µF nominal capacitance with a rated voltage of 6.3 V and capacitance tolerance of −20% to +20%.
• Low Impedance Performance — Specified impedance of 440 mΩ and tangent of loss angle (tanδ) 0.26 (measured at 20°C, 120 Hz) for efficient AC performance.
• Ripple Current Capability — Rated low‑frequency ripple current 230 mA (120 Hz) and high‑frequency ripple current 345 mA (10 kHz) for filtering and decoupling applications.
• Leakage & Reliability — Leakage current specified at 6.3 µA and endurance rated for 2000 hours at 105°C.
• Temperature Range — Operates over −55°C to +105°C for broad environmental compatibility.
• Package & Assembly — Compact φ6.3×5.8 mm can in surface‑mount format with embossed carrier taping suitable for automatic mounting machines.
• Standards & Compliance — AEC‑Q200 qualified and RoHS compliant.

Typical Applications

• Automotive electronic modules — SMD bulk and decoupling capacitor for control modules where AEC‑Q200 qualification and wide temperature range are required.
• High‑density PCB power management — Compact chip‑type can for local energy storage and smoothing on space‑constrained boards.
• Automated surface‑mount production — Embossed carrier taping form factor for use with automatic placement equipment in volume manufacturing.

Unique Advantages

• Engineered for low impedance: 440 mΩ impedance and a specified tanδ (0.26 at 120 Hz) support effective AC performance and reduced voltage ripple.
• Compact, assembly‑friendly package: φ6.3×5.8 mm SMD can and embossed carrier taping simplify BOM and automated placement on dense PCBs.
• Automotive‑grade qualification: AEC‑Q200 rating aligns the part with demanding automotive reliability requirements.
• Wide operating temperature: −55°C to +105°C operation with 2000‑hour endurance at 105°C for sustained performance in harsh environments.
• Balanced leakage and ripple handling: Low leakage current (6.3 µA) combined with LF and HF ripple ratings (230 mA / 345 mA) supports power integrity in mixed‑signal systems.

Why Choose UUD0J101MCL1GS?

The UUD0J101MCL1GS combines chip‑type SMD convenience with low‑impedance electrical characteristics and automotive‑grade qualification, making it well suited for engineers designing compact, reliable power rails and decoupling networks. Its compact φ6.3×5.8 mm can, embossed carrier taping, and specified ripple and leakage parameters deliver a pragmatic balance of performance and manufacturability for volume production.

This part is positioned for designs that require proven endurance (2000 hours at 105°C), RoHS compliance, and automated assembly readiness—providing long‑term availability through mass production for stable supply planning.

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