UUD0J221MCL1GS

The UUD0J221MCL1GS is a surface-mount aluminum electrolytic capacitor in Nichicon’s UUD chip-type, low-impedance family. It delivers 220 µF at 6.3 V in a compact φ6.3 × 5.8 mm SMD can designed for high-density PCB assemblies and automatic placement.

Engineered for reliability in demanding thermal environments, this part is specified for operation from -55 °C to 105 °C with an endurance rating of 2000 hours at 105 °C, and carries AEC-Q200 qualification and RoHS compliance for stringent application requirements.

Key Features

• Core Capacitance & Voltage — 220 µF nominal capacitance with a rated voltage of 6.3 V and a tolerance of -20% to +20% (120 Hz, 20 °C).
• Low Impedance Chip-Type Construction — Chip-type, low-impedance design with an impedance specification of 440 mΩ to support decoupling and filtering in compact SMD designs.
• Loss Characteristics — Tangent of loss angle (tan δ) 0.26 measured at 120 Hz and 20 °C, providing a defined dissipation behavior for design margins.
• Ripple Current Capability — Low-frequency ripple current of 230 mA at 120 Hz and high-frequency ripple current of 345 mA at 10 kHz to address both bulk and higher-frequency ripple conditions.
• Leakage Current — Specified leakage current of 13.86 µA after standard application conditions.
• High-Temperature Endurance — Rated for 2000 hours at 105 °C (restored to 20 °C for final measurement), supporting long-term stability in elevated-temperature environments.
• Wide Operating Temperature — Operates across -55 °C to 105 °C for broad environmental suitability.
• Compact SMD Package & Assembly — φ6.3 × 5.8 mm SMD can with embossed carrier taping for automated placement on high-density PCBs.
• Industry Qualification & Compliance — AEC-Q200 qualified and RoHS compliant for regulated applications.

Typical Applications

• Automotive Electronics — Suitable for automotive applications where AEC-Q200 qualification and operation to 105 °C are required.
• High-Density PCB Assemblies — Designed for surface mounting on high-density PC boards where compact, low-impedance capacitors are needed.
• Automated SMT Production — Supplied in embossed carrier taping and compatible with automatic mounting machines, enabling efficient pick-and-place assembly.

Unique Advantages

• Compact, High-Capacity SMD Form — 220 µF in a φ6.3 × 5.8 mm chip-style can reduces board area while delivering bulk capacitance.
• Low-Impedance Performance — 440 mΩ impedance and defined tan δ support effective filtering and decoupling in tight-layout power designs.
• Dual-Frequency Ripple Handling — Specified ripple current at both 120 Hz and 10 kHz addresses a range of power-line and switching-frequency stresses.
• Robust Thermal Endurance — 2000 hours at 105 °C and an operating range to -55 °C provide predictable performance across extended temperature cycles.
• Automotive-Grade Qualification — AEC-Q200 qualification supports usage in regulated automotive subsystems that require component-level qualification.
• Assembly-Ready Packaging — Embossed carrier taping enables straightforward integration into automated SMT production flows.

Why Choose UUD0J221MCL1GS?

UUD0J221MCL1GS combines a compact SMD chip can with low-impedance characteristics, defined loss angle, and dual-frequency ripple capability—making it a practical choice for engineers designing compact power and decoupling solutions under thermal stress. Its AEC-Q200 qualification, RoHS compliance, and 2000-hour endurance at 105 °C position it for demanding applications that require traceable qualification and predictable long-term behavior.

This capacitor is well suited for teams building compact, automated-production assemblies where board space, thermal endurance, and compliance are priorities. Its carrier-tape packaging and SMD form factor simplify high-volume manufacturing while delivering the electrical characteristics specified for reliable system performance.

Request a quote or submit an inquiry to our sales team to evaluate UUD0J221MCL1GS for your next design and to obtain pricing, availability, and sample information.