UUD0J270MCL1GS

The UUD0J270MCL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface‑mount placement on high‑density printed circuit boards. It delivers 27 µF at 6.3 V in a compact φ4 × 5.8 mm SMD can, with embossed carrier taping for automated assembly.

Engineered for demanding temperature and endurance conditions, this Nichicon part is AEC‑Q200 qualified, RoHS compliant and rated for operation from −55 °C to +105 °C with a specified endurance of 2000 hours at 105 °C for this size.

Key Features

• Capacitance & Voltage: 27 µF capacitance with a rated voltage of 6.3 V and ±20% tolerance (120 Hz, 20 °C).
• Low Impedance Performance: Specified impedance of 1.8 Ω and low loss (tan δ ≤ 0.26 at 120 Hz, 20 °C for 6.3 V) to support decoupling and filtering in compact designs.
• Ripple Current Capability: Rated ripple current of 80 mA at low frequency (105 Hz) and 120 mA at high frequency (10 kHz) to handle AC ripple across a range of signal conditions.
• Leakage & Endurance: Leakage current limited to 3 µA and rated for 2000 hours at 105 °C (φ4 size), supporting reliability in elevated temperature environments.
• Package & Mounting: Chip‑type radial can for SMD applications (φ4 × 5.8 mm) with recommended land size 4.3 × 4.3 mm and supplied in embossed carrier taping for pick‑and‑place automation.
• Environmental & Quality: RoHS compliant and AEC‑Q200 qualified, indicating suitability for applications that require recognized component reliability standards.

Typical Applications

• Automotive electronic modules: AEC‑Q200 qualification and a −55 °C to +105 °C temperature range make this part suitable for vehicle electronics that require compact bulk capacitance and reliability.
• Power supply decoupling and filtering: Low impedance and defined ripple current ratings support smoothing and local decoupling in DC‑DC converters and power rails.
• High‑density SMD assemblies: The φ4 × 5.8 mm chip can and embossed carrier taping enable automated placement in space‑constrained board designs.

Unique Advantages

• AEC‑Q200 qualified: Meets an industry reliability standard used in demanding electronic systems.
• Compact SMD can: Small φ4 × 5.8 mm package delivers 27 µF capacitance while minimizing board area.
• Designed for automated assembly: Embossed carrier taping supports high‑volume pick‑and‑place manufacturing.
• High temperature endurance: Rated for 2000 hours at 105 °C (φ4 size), supporting sustained performance in elevated ambient conditions.
• Quantified ripple and leakage specs: Defined low‑frequency and high‑frequency ripple current ratings plus a 3 µA leakage limit enable predictable power‑stage design.
• RoHS compliant: Meets current environmental directive requirements for lead‑free assemblies.

Why Choose UUD0J270MCL1GS?

UUD0J270MCL1GS positions itself as a compact, reliable aluminum electrolytic solution where space, endurance and defined electrical behavior matter. With low impedance, specified ripple handling, low leakage and AEC‑Q200 qualification, it is targeted at designers seeking a verified SMD capacitor for automotive and other temperature‑challenged, high‑density electronic systems.

Its embossed carrier taping and SMD can package simplify assembly while the documented endurance and electrical limits provide predictable long‑term behavior for procurement and design validation.

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