UUD1A220MCL1GS

The UUD1A220MCL1GS is a chip-type aluminum electrolytic capacitor from Nichicon’s UUD series designed for surface-mount use on high-density printed circuit boards. It delivers a 22 µF capacitance at 10 V with low impedance characteristics and is optimized for automated assembly using carrier-tape feed.

Key value propositions include operation across a wide temperature range (−55 °C to +105 °C), AEC-Q200 qualification for automotive applications, and construction tailored for reliable performance in space-constrained SMD layouts.

Key Features

• Electrical Performance — 22 µF capacitance at 10 V rated voltage with tolerance −20% to +20%; low impedance design (impedance 1.8 Ω) for stable decoupling and filtering.
• Ripple Handling — Specified ripple current ratings of 80 mA at 120 Hz and 120 mA at 10 kHz to support AC ripple and switching workloads.
• Thermal and Reliability — Operating temperature range −55 °C to +105 °C with a rated lifetime of 2000 hours at 105 °C; endurance and shelf-life characteristics conform to series specifications.
• Leakage and Loss — Leakage current limits per datasheet (after 2 minutes at rated voltage at 20 °C, not more than 0.01 CV or 3 µA, whichever is greater) and specified tan δ limits by voltage class.
• Package and Mounting — Chip-type, radial can SMD package sized L: 5.8 × D: 4 mm with recommended surface-mount land size 4.3 × 4.3 mm; compatible with automatic mounting machines fed with carrier tape.
• Standards and Compliance — RoHS compliant and AEC-Q200 qualified for applications that require automotive-grade component qualification.

Typical Applications

• Automotive Electronics — AEC-Q200 qualification enables use in automotive electronic modules that require high-temperature and reliability characteristics.
• High-Density SMD Boards — Designed for surface mounting on compact, high-density PCBs and compatible with automated carrier-tape placement.
• Thermally Demanding Designs — Suitable for circuits requiring operation across −55 °C to +105 °C and rated endurance at elevated temperature (2000 hours at 105 °C).
• Space-Constrained Power Filtering — Small footprint (L: 5.8 × D: 4 mm) with defined land pattern (4.3 × 4.3 mm) for tight board layouts.

Unique Advantages

• Low-Impedance Chip Construction: Chip-type low impedance design (1.8 Ω) provides effective filtering in compact SMD applications.
• Automated Assembly Ready: Compatible with carrier-tape fed automatic mounting machines to streamline high-volume PCB assembly.
• Elevated Temperature Endurance: Rated for operation up to +105 °C with 2000 hours life at that temperature, supporting thermally demanding environments.
• Automotive-Grade Qualification: AEC-Q200 qualification supports selection for automotive electronics where component qualification is required.
• Compact PCB Footprint: Small L: 5.8 × D: 4 mm package and recommended land size (4.3 × 4.3 mm) reduce board area while preserving capacitance.

Why Choose UUD1A220MCL1GS?

The UUD1A220MCL1GS combines low-impedance aluminum electrolytic performance with a chip-style SMD package engineered for high-density boards and automated production. Its specified ripple current ratings, controlled leakage characteristics, and elevated temperature endurance make it suitable for reliable operation in demanding assemblies.

This part is particularly well suited to designs that require compact power-filtering components with automotive-grade qualification (AEC-Q200) and RoHS compliance—offering a balance of size, thermal capability, and assembly readiness for long-term deployments.

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