UUD1A330MCL1GS

The UUD1A330MCL1GS is a chip-type aluminum electrolytic capacitor from Nichicon's UUD series, engineered for surface-mount use on high-density PC boards. It delivers low impedance performance in a compact SMD can package and is designed for automated assembly with carrier-tape feeding.

Key use cases include power decoupling and bulk energy storage in compact electronic modules where elevated temperature endurance, AEC-Q200 qualification, and RoHS compliance are required.

Key Features

• Capacitance & Voltage: 33 µF rated at 10 V for mid-voltage decoupling and energy storage in compact power rails.
• Low Impedance: Specified impedance of 760 mΩ to help reduce AC voltage drop and improve transient response.
• Temperature & Lifetime: Operates from −55 °C to +105 °C with a rated lifetime of 2000 hours at 105 °C.
• Ripple Current Capability: 150 mA at 120 Hz and 225 mA at 10 kHz, supporting both low- and high-frequency ripple conditions.
• Package & Mounting: Chip-type radial can SMD, dimensions L: 5.8 × D: 5 mm with surface mount land size 5.3 × 5.3 mm; applicable to automatic mounting machines fed with carrier tape.
• Reliability & Compliance: AEC-Q200 qualified and RoHS compliant; polarized construction with standard capacitance tolerance of −20% to +20%.
• Leakage Current (series spec): After 2 minutes' application of rated voltage at 20 °C, leakage current is not more than 0.01 CV or 3 µA, whichever is greater.

Typical Applications

• Automotive Electronics: Use in compact power rails, sensor modules, and control units where AEC-Q200 qualification and high-temperature endurance are necessary.
• DC–DC Converter Output Filtering: Low impedance and targeted ripple current ratings support output smoothing and transient handling in small-form power converters.
• Embedded Power Decoupling: Surface-mount chip format and automated-assembly compatibility make it suitable for high-density PCBs in communication and control modules.
• Telematics and Sensor Nodes: Compact size and wide temperature range enable reliable bulk storage and decoupling in constrained enclosures exposed to automotive or industrial thermal conditions.

Unique Advantages

• AEC-Q200 Qualification: Supplies confidence for designs targeting automotive and similarly demanding environments.
• Compact, Assembly-Friendly Package: Chip-type SMD can with carrier-tape compatibility reduces PCB space and streamlines automated placement.
• Wide Operating Temperature Range: −55 °C to +105 °C supports applications exposed to broad thermal conditions without derating design intent.
• Measured Ripple Performance: Specified ripple current values at 120 Hz and 10 kHz assist in matching capacitor selection to both low- and high-frequency power demands.
• RoHS Compliance: Meets current environmental directive requirements for lead-free electronics manufacturing.

Why Choose UUD1A330MCL1GS?

The UUD1A330MCL1GS combines low impedance, compact SMD packaging, and automotive-grade qualification to meet the needs of engineers designing robust power delivery networks in space-constrained boards. Its specified ripple handling and temperature endurance make it well suited for mid-voltage decoupling and bulk energy storage in embedded controllers, power modules, and automotive electronics.

Choose this part when you need a verified, surface-mount aluminum electrolytic capacitor that supports automated assembly, complies with RoHS, and aligns with AEC-Q200 reliability expectations for demanding applications.

Request a quote or contact sales to discuss availability, lead times, and integration details for UUD1A330MCL1GS.