UUD1A560MCL1GS

The UUD1A560MCL1GS is a chip-type aluminum electrolytic capacitor designed for surface-mount use on high-density PC boards. It provides 56 µF capacitance at a 10 V rating with low impedance characteristics and is optimized for automated assembly (carrier-tape feed).

Engineered for demanding environments, the part supports operation from -55 °C to +105 °C and is AEC-Q200 qualified with RoHS compliance, making it suitable for automotive and other reliability-focused applications.

Key Features

• Electrical Performance — 56 µF capacitance at 10 V with a tolerance of ±20% and an impedance of 440 mΩ for low-impedance decoupling and energy buffering.
• Ripple Handling — Rated ripple current of 230 mA at 120 Hz and 345 mA at 10 kHz, supporting both low- and high-frequency filtering needs.
• Temperature Range & Endurance — Operating temperature range from -55 °C to +105 °C; endurance tested under rated voltage for 2000 hours at 105 °C (meets series endurance criteria for φD = 6.3).
• Reliability Metrics — Leakage current meets 0.01 CV or 3 µA (whichever is greater) after 2 minutes at 20 °C; tan δ ≤ 0.20 (120 Hz, 20 °C) for the 10 V rating; stability and endurance specifications documented in the series datasheet.
• Package & Board-Level Integration — Radial can SMD chip type designed for surface mounting on high-density boards; compatible with automatic mounting machines fed with carrier tape. Recommended PCB land size: 6.6 × 6.6 mm.
• Assembly & Robustness — Meets resistance-to-soldering-heat criteria (30 s on a 250 °C hot plate) with capacitance change within ±10%, and maintains leakage and tan δ within specified limits after soldering.
• Compliance & Qualification — AEC-Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863), supporting regulated and reliability-focused designs.

Typical Applications

• Automotive Electronics — Suited for automotive electronic modules and control units where AEC-Q200 qualification and operation up to +105 °C are required.
• Power Supply Filtering — Use in board-level decoupling and smoothing where low impedance and defined ripple-current capability improve voltage stability.
• High-Density Surface-Mount Designs — Designed for compact PCBs and automated placement, enabling higher component density in module designs.

Unique Advantages

• Low-Impedance Performance: 440 mΩ impedance specification provides effective decoupling and energy delivery in compact SMD format.
• Automated Assembly Ready: Carrier-tape compatibility and SMD chip form factor simplify integration into automated production flows.
• Qualified for Reliability: AEC-Q200 qualification and documented endurance at 105 °C support use in demanding, regulation-driven applications.
• Wide Temperature Range: -55 °C to +105 °C operation supports deployment across harsh environmental conditions.
• Measurable Endurance and Solder Robustness: Endurance and soldering-heat characteristics are specified, enabling predictable life and assembly outcomes.
• RoHS Compliant: Conforms to 2011/65/EU and (EU)2015/863 requirements for restricted substances.

Why Choose UUD1A560MCL1GS?

UUD1A560MCL1GS combines a compact chip-type SMD package with low-impedance electrical performance and documented reliability metrics, making it a practical choice for designers needing robust capacitance in space-constrained, automated-assembly applications. Its AEC-Q200 qualification and RoHS compliance align with regulated and automotive-grade design requirements.

This capacitor is appropriate for engineers and purchasers specifying components for high-density boards where predictable ripple handling, temperature performance, and assembly compatibility are required to meet system-level reliability targets.

If you would like pricing, availability, or a formal quote for UUD1A560MCL1GS, please submit a request or contact our quoting team to initiate the process.