UUD1C560MCL1GS

The UUD1C560MCL1GS from Nichicon is a chip‑type aluminum electrolytic capacitor in the UUD series, designed for surface mounting on high‑density PC boards. It delivers 56 µF at a 16 V rating in a compact SMD can package.

Engineered for demanding temperature environments and automated assembly, this device is RoHS compliant and AEC‑Q200 qualified, offering low impedance and specified endurance for automotive and other high‑reliability applications.

Key Features

• Electrical Performance: 56 µF rated capacitance at 16 V with ±20% tolerance; polarization is polarized.
• Low Impedance: Specified impedance of 440 mΩ to support stable filtering and decoupling in compact power circuits.
• Ripple Current Capability: Rated ripple current of 230 mA at 120 Hz and 345 mA at 10 kHz for handling AC ripple in power paths.
• Temperature & Reliability: Operating temperature range −55 °C to +105 °C with a rated lifetime of 2000 hours at +105 °C.
• AEC‑Q200 Qualified: Meets AEC‑Q200 requirements for applications requiring recognized component stress testing.
• Surface‑Mount, Chip‑Type Package: Radial can SMD chip package sized L: 5.8 × D: 6.3 mm with a maximum seated height of 5.8 mm; suitable for high‑density PCB layouts.
• Assembly‑Ready: Applicable to automatic mounting machines fed with carrier tape for streamlined production.
• Regulatory Compliance: RoHS compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics — AEC‑Q200 qualification and a −55 °C to +105 °C rating make this capacitor suitable for board‑level power components in automotive systems.
• High‑Density SMD Power Assemblies — Chip‑type can package and small footprint support decoupling and bulk capacitance on space‑constrained PCBs.
• Automated PCB Assembly — Designed for use with carrier‑tape fed automatic mounting machines to support high‑volume production.
• Harsh‑Temperature Environments — Rated for operation and endurance at elevated temperatures up to +105 °C with a specified 2000‑hour life at that temperature.

Unique Advantages

• Compact, high‑capacitance SMD solution: 56 µF in a 5.8 × 6.3 mm chip‑type can reduces board area compared with larger radial options.
• Low impedance for stable power delivery: 440 mΩ impedance helps lower voltage ripple and supports reliable decoupling in power circuits.
• Designed for automated production: Carrier‑tape compatibility enables efficient placement in high‑volume surface‑mount assembly.
• Automotive‑grade reliability: AEC‑Q200 qualification and 2000 hours’ endurance at +105 °C address longevity requirements for demanding applications.
• Broad ripple handling: Specified ripple currents at both 120 Hz and 10 kHz provide deterministic performance across common ripple spectrums.
• Regulatory compliance: RoHS conformity supports environmentally restricted product designs.

Why Choose UUD1C560MCL1GS?

The UUD1C560MCL1GS combines a compact chip‑type SMD can package with low impedance and automotive‑grade qualification, making it a practical choice for designers needing reliable bulk and decoupling capacitance in space‑constrained, high‑temperature assemblies. Its specified ripple current ratings, RoHS compliance, and compatibility with automated mounting support both performance and manufacturability goals.

This part is well suited to engineers and procurement teams specifying components for automotive electronics and other applications that require verified endurance at elevated temperature, surface‑mount compatibility, and traceable qualification from a recognized manufacturer.

Request a quote or submit a technical inquiry for UUD1C560MCL1GS to receive pricing, availability, and application support.