UUD1E101MCL1GS
| Part Description |
100 µF 25 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 584 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UUD |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 100 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 8 mm | HTS Code | 8532.22.0020 | ||
| Impedance | 340 mOhm | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 420 mA @ 10 kHz | Ripple Current Low Frequency | 280 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 7.7 x 6.3 mm | Surface Mount Land Size | 6.6 x 6.6 mm | ||
| Tolerance | -20%~20% | Voltage | 25 V |
Overview of UUD1E101MCL1GS – Chip Type Low Impedance Aluminum Electrolytic Capacitor, 100 µF, 25 V
The UUD1E101MCL1GS is a chip-type aluminum electrolytic capacitor engineered for surface-mount use on high-density printed circuit boards. It delivers a 100 µF capacitance at 25 V in a compact SMD can package and is compatible with carrier-tape automated mounting.
Designed for demanding temperature environments, this part operates from -55 °C to +105 °C, is RoHS compliant, and carries AEC-Q200 qualification for automotive-grade reliability and endurance under elevated temperature stress.
Key Features
- Capacitance & Voltage: 100 µF rated capacitance at 25 V for bulk energy storage in compact SMD form.
- Low Impedance: Specified impedance of 340 mΩ to help minimize voltage drop and support stable performance under AC conditions.
- Temperature & Endurance: Operates from -55 °C to +105 °C with a rated lifetime of 2000 hours at 105 °C.
- Ripple Current Performance: Rated ripple current of 280 mA at 120 Hz and 420 mA at 10 kHz for AC and high-frequency applications.
- Package & Mounting: Chip-type, radial can SMD designed for surface mounting on high-density PCBs and compatible with automatic mounting machines fed by carrier tape.
- Automotive Qualification & Compliance: AEC-Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863) for regulatory and industry requirements.
- Board Footprint: Compact size L: 7.7 × D: 6.3 mm with recommended land pattern L: 6.6 × W: 6.6 mm for dense PCB layouts.
Typical Applications
- Automotive Electronics: Suitable for vehicle electronic modules where AEC-Q200 qualification and elevated temperature endurance are required.
- High‑Density Surface‑Mount Assemblies: Chip-type SMD construction supports use on densely populated PCBs requiring compact bulk capacitance.
- Automated Production Lines: Carrier-tape compatibility enables efficient placement with automatic mounting equipment for high-volume manufacturing.
Unique Advantages
- Low-Impedance Design: 340 mΩ impedance contributes to reduced AC voltage loss and stable behavior under ripple conditions.
- Wide Operating Temperature: Rated from -55 °C to +105 °C to meet thermal requirements across harsh environments.
- Automotive-Grade Reliability: AEC-Q200 qualification provides a documented baseline for automotive system integration.
- Verified Endurance: Specified for 2000 hours at 105 °C, offering predictable lifetime characteristics for long-term designs.
- Assembly-Ready Packaging: Chip-type SMD and carrier-tape applicability reduce handling and enable automated placement to streamline production.
- Regulatory Compliance: RoHS compliance aligns the component with common environmental directives.
Why Choose UUD1E101MCL1GS?
UUD1E101MCL1GS is positioned for designs that require a compact, low-impedance aluminum electrolytic capacitor with verified high-temperature endurance and automotive-level qualification. Its combination of 100 µF at 25 V, specified ripple current performance, and AEC-Q200 qualification makes it a practical choice for engineers building reliable, high-density surface-mount systems.
The chip-type SMD package and carrier-tape compatibility help simplify high-volume assembly while the RoHS compliance and defined board footprint ease regulatory and layout planning for production designs.
Request a quote or submit an inquiry to our sales team to evaluate UUD1E101MCL1GS for your next design project.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016