UUD1E150MCL1GS

The UUD1E150MCL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor in a compact surface‑mount can. It delivers 15 µF at 25 V in a φ5 × 5.8 mm package designed for high‑density PCBs and automatic assembly.

Engineered for elevated operating conditions, the device is AEC‑Q200 rated, RoHS compliant and specified for operation from −55 °C to 105 °C with an endurance of 2000 hours at 105 °C. It is supplied in embossed carrier taping for pick‑and‑place production lines.

Key Features

• Core Construction — Chip‑type, low impedance aluminum electrolytic capacitor in a radial can SMD package optimized for surface mounting.
• Electrical Performance — 15 µF nominal capacitance with tolerance −20% to +20% and rated voltage 25 V.
• Loss & Impedance — Low dissipation factor: tan δ = 0.14 (measured at 20 °C, 120 Hz) and impedance specified as 760 mΩ.
• Ripple & Leakage — Low frequency ripple current 150 mA (120 Hz) and high frequency ripple current 225 mA (10 kHz); leakage current specified at 3.75 µA.
• Reliability & Qualification — AEC‑Q200 rated with endurance of 2000 hours at 105 °C (specified for φD = 5); specified operating temperature range −55 °C to 105 °C.
• Package & Assembly — Compact dimensions φ5 × 5.8 mm, surface‑mount land size L: 5.3 × W: 5.3 mm, supplied in embossed carrier taping for automatic mounting.
• Environmental Compliance — RoHS compliant and in mass production status.

Typical Applications

• Automotive Electronics — Suitable for automotive electronic modules where AEC‑Q200 qualification and high temperature endurance are required.
• High‑Density Surface‑Mount Boards — Designed for use on compact, high‑density PCBs that require SMD components in a small footprint.
• Automated Assembly Processes — Supplied in embossed carrier taping to support automated pick‑and‑place production lines.

Unique Advantages

• Low Impedance and Low Loss: 760 mΩ impedance and tan δ = 0.14 (20 °C, 120 Hz) provide stable AC performance where low ESR/low loss is needed.
• Compact SMD Form Factor: φ5 × 5.8 mm size minimizes board area while providing 15 µF capacitance in an SMD can package.
• Designed for Harsh Environments: −55 °C to 105 °C operating range and 2000 h endurance at 105 °C support demanding temperature conditions.
• Ripple Handling: Specified ripple currents of 150 mA (120 Hz) and 225 mA (10 kHz) accommodate AC stress across a range of frequencies.
• Production‑Ready Packaging: Embossed carrier taping enables consistent feed for automatic mounting machines and high‑volume assembly.
• Regulatory Compliance: RoHS compliant and AEC‑Q200 rated for markets that require those standards.

Why Choose UUD1E150MCL1GS?

UUD1E150MCL1GS combines compact SMD packaging with low‑impedance electrical characteristics and automotive‑grade qualification to meet the needs of dense, reliability‑focused electronic designs. Its specified ripple performance, low leakage, and controlled dissipation factor make it suitable for applications that require stable capacitance and thermal endurance up to 105 °C.

This part is well suited for engineers and procurement teams designing for automotive or industrial environments that demand AEC‑Q200 qualification, automated assembly compatibility, and RoHS conformance. Its production‑ready packaging and clear endurance specification simplify integration into high‑volume manufacturing.

To request a quote or submit a purchasing inquiry for UUD1E150MCL1GS, please contact sales with your quantity, required delivery timeline, and any application notes so we can provide pricing and availability information tailored to your needs.