UUD1H680MNL1GS

The UUD1H680MNL1GS is a chip-type aluminum electrolytic capacitor in Nichicon’s UUD series, designed for surface-mount use on high-density printed circuit boards. It provides a 68 µF capacitance at 50 V with a low-impedance construction and is suitable for automated assembly from carrier tape.

Key value comes from its combination of low impedance, a wide operating temperature range to +105 °C, and AEC-Q200 qualification with RoHS compliance—features that address reliability and assembly efficiency in demanding applications.

Key Features

• Capacitance & Voltage — Rated at 68 µF and 50 V to support decoupling and bulk energy storage in compact SMD designs.
• Low Impedance & Ripple Handling — Specified impedance of 340 mΩ, with ripple current ratings of 300 mA at 120 Hz and 450 mA at 10 kHz to support dynamic load conditions.
• Temperature & Endurance — Operating range from −55 °C to +105 °C and a lifetime rating of 5000 hours at 105 °C, suitable for sustained high-temperature operation.
• Package & Mounting — Chip-type SMD (radial, can-style) with physical size L: 1.0 × D: 0.8 cm and recommended land pattern 8.3 × 8.3 mm; designed for surface mounting and automatic tape-fed assembly.
• Tolerance & Leakage — Capacitance tolerance ±20% and leakage current controlled to ≤ 0.01·C·V or 3 µA (whichever is greater) after two minutes at 20 °C, per datasheet specification.
• Qualification & Compliance — AEC-Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863), supporting reliability and regulatory requirements.

Typical Applications

• Automotive Electronics — Use in automotive modules where AEC-Q200 qualification and operation to +105 °C are required.
• Power Supply Decoupling — On-board smoothing and decoupling in compact SMD power stages, leveraging low impedance and rated voltage of 50 V.
• High-Density PCB Assemblies — Integration on tightly packed boards where tape-fed automatic placement and a chip SMD form factor reduce assembly complexity.

Unique Advantages

• Low-impedance performance: 340 mΩ impedance helps reduce voltage ripple and improve transient response in power circuits.
• High-temperature endurance: Rated for operation to +105 °C with a 5000-hour endurance at that temperature, supporting long-term reliability in elevated-temperature environments.
• Automotive-grade qualification: AEC-Q200 qualification provides documented reliability credentials for automotive and other demanding applications.
• Assembly-friendly SMD package: Chip-type can package with carrier-tape compatibility simplifies automated placement and high-density PCB layouts.
• Measurable leakage control: Leakage current specified to ≤ 0.01·C·V or 3 µA after two minutes, enabling predictable bias behavior in designs.
• Regulatory compliance: RoHS compliant to the indicated directives, supporting regulatory requirements for many production environments.

Why Choose UUD1H680MNL1GS?

The UUD1H680MNL1GS combines a compact chip-style SMD package with low impedance, robust ripple handling, and high-temperature endurance—making it a practical choice where board space, assembly efficiency, and sustained thermal performance matter. Its AEC-Q200 qualification and RoHS compliance align the part with reliability and regulatory expectations for higher-reliability markets.

This capacitor is well suited to engineers and procurement teams specifying capacitors for compact power stages, automotive electronics, and other applications that require predictable leakage, assembly-friendly packaging, and proven high-temperature endurance.

For pricing, availability, or to request a quote for UUD1H680MNL1GS, please submit a quote request or contact sales to discuss your volume and delivery requirements.