UUD1H3R3MCL1GS

The UUD1H3R3MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface mounting on high-density printed circuit boards. It combines a compact SMD can package with performance characteristics tailored for demanding environments.

With an operating temperature range of -55 °C to +105 °C, AEC-Q200 qualification, and RoHS compliance, this 3.3 µF, 50 V device is positioned for applications that require automotive-grade reliability, automated assembly compatibility, and stable electrical performance under elevated temperature conditions.

Key Features

• Chip-type, Low Impedance Designed as a chip-style SMD aluminum electrolytic capacitor to deliver low-impedance performance in a compact form factor.
• Electrical Specifications Rated capacitance 3.3 µF at 50 V with ±20% tolerance and polarized construction for DC applications.
• Impedance and Ripple Handling Specified impedance of 5 Ω and ripple current ratings of 30 mA at 120 Hz and 45 mA at 10 kHz for filter and smoothing tasks.
• Temperature and Lifetime Operates from -55 °C to +105 °C and rated for 2000 hours at 105 °C, enabling use in elevated-temperature environments.
• AEC-Q200 Qualified & RoHS Compliant Meets AEC-Q200 qualification and is compliant with RoHS directives, supporting regulated and automotive applications.
• Surface-Mount Package & Automated Assembly Compact package size L: 5.8 × D: 4 mm with recommended land size L: 4.3 × W: 4.3 mm; applicable to automatic mounting machines fed with carrier tape.
• Leakage and Endurance Characteristics Leakage current specification: after 2 minutes at 20 °C it is not more than 0.01 CV or 3 µA (whichever is greater); endurance characteristics meet series specifications after rated voltage and temperature stress.

Typical Applications

• Automotive Electronics Suitable for automotive modules where AEC-Q200 qualification and elevated-temperature endurance are required.
• Power Supply Filtering Used for smoothing and decoupling on compact power rails and DC power circuits that require a 3.3 µF, 50 V capacitor with defined ripple ratings.
• High-Density SMD Assemblies Designed for surface mounting on high-density PCBs and compatible with automated carrier-tape assembly processes.

Unique Advantages

• Automotive-Grade Qualification: AEC-Q200 qualification provides an accepted reliability baseline for vehicle electronics and other high-reliability systems.
• Compact, Assembly-Ready Package: Small L: 5.8 × D: 4 mm SMD can with defined land pattern supports dense board layouts and automated placement.
• Wide Temperature Range: Rated from -55 °C to +105 °C with a 2000-hour lifetime at 105 °C, enabling stable performance in elevated-temperature applications.
• Measured Ripple Handling: Specified ripple currents (30 mA @ 120 Hz, 45 mA @ 10 kHz) and a 5 Ω impedance rating offer predictable behavior for filtering tasks.
• Regulatory Compliance: RoHS compliance supports use in regulated markets and simplifies environmental compliance management.

Why Choose UUD1H3R3MCL1GS?

The UUD1H3R3MCL1GS delivers an integrated balance of compact SMD packaging, defined electrical performance, and durability across a wide temperature range. Its AEC-Q200 qualification and RoHS compliance make it a practical choice where automotive-grade reliability and regulatory compliance are required.

This part is well suited for design teams developing compact power modules, high-density PCBs, and automotive electronic assemblies that need a verified SMD electrolytic capacitor with clear ripple, impedance, and lifetime specifications.

If you need pricing, availability, or a formal quote for the UUD1H3R3MCL1GS, request a quote or submit an RFQ and our team will respond with details and lead-time information.