UUD1H221MNL1GS

The UUD1H221MNL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor in a surface‑mount can designed for high‑density PCBs. With a rated capacitance of 220 µF and a 50 V rating, it delivers bulk energy storage and filtering capability in a compact φ10 × 10 mm package.

Engineered for demanding thermal and lifecycle requirements, this part supports operation from −55 °C to 105 °C, is AEC‑Q200 qualified, and is supplied in embossed carrier tape for automated placement. It is particularly suited to designs that require robust ripple handling, low loss, and long endurance.

Key Features

• Capacitance & Voltage — 220 µF nominal capacitance with ±20% tolerance, rated for 50 V operation.
• Low Impedance Power Performance — Specified impedance of 180 mOhm and a tanδ of 0.14 measured at 20 °C, 120 Hz, enabling effective smoothing and bulk decoupling in power supply circuits.
• Ripple Current Capability — Low‑frequency ripple current 670 mA (at 105 Hz) and high‑frequency ripple current 1.005 A (at 10 kHz), supporting demanding AC ripple conditions.
• Leakage Current — Maximum leakage current of 110 µA, aiding predictable bias behavior after voltage is applied.
• Temperature & Endurance — Operates from −55 °C to 105 °C with an endurance rating of 5000 hours at 105 °C.
• Automotive‑grade Qualification — AEC‑Q200 qualified for use in applications requiring recognized passive component stress screening.
• Surface‑Mount, Assembly‑Friendly Package — Chip can SMD, φ10 × 10 mm size, supplied in embossed carrier taping compatible with automatic mounting machines.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Automotive systems — Suitable for automotive electronic modules where AEC‑Q200 qualification and the −55 °C to 105 °C operating range are required.
• Surface‑mount power filtering — Low impedance, measured tanδ, and specified ripple currents make this capacitor appropriate for bulk smoothing and decoupling on compact PCBs.
• High‑density PCB assembly — Chip‑type can and embossed carrier tape packaging enable automated placement in high‑density surface‑mount production.

Unique Advantages

• High ripple tolerance: Rated ripple currents of 670 mA (105 Hz) and 1.005 A (10 kHz) support stable operation under AC stress, reducing thermal buildup in high‑ripple environments.
• Consistent electrical behavior: Low impedance (180 mOhm) and a specified tanδ provide predictable loss characteristics for power‑supply design and frequency response calculations.
• Long endurance at elevated temperature: 5000 hours at 105 °C supports designs that require extended life under thermal stress.
• Automotive‑grade reliability: AEC‑Q200 qualification helps accelerate adoption into automotive and other high‑reliability programs.
• Assembly efficiency: Embossed carrier taping and chip‑type SMD packaging streamline automated placement and yield compact PCB layouts.

Why Choose UUD1H221MNL1GS?

The UUD1H221MNL1GS balances high capacitance and voltage rating with low impedance and measurable loss characteristics, making it a solid choice where bulk energy storage, ripple handling, and long life at elevated temperatures are required. Its AEC‑Q200 qualification and RoHS compliance position it for use in programs that demand traceable reliability and environmental conformance.

This part is suited to engineers designing compact, surface‑mount power systems and automotive electronics that require predictable electrical performance, automated assembly compatibility, and endurance over prolonged thermal stress.

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