UUD1H101MNL1GS

The UUD1H101MNL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor engineered for surface mounting on high‑density PC boards. It delivers 100 µF capacitance at a 50 V rating in a compact SMD radial/can package designed for automated carrier‑tape assembly.

Built for demanding temperature and reliability requirements, this capacitor supports an operating range of −55 °C to +105 °C, is AEC‑Q200 qualified, RoHS compliant, and rated for 5000 hours at 105 °C—making it suitable for automotive and other high‑reliability electronics.

Key Features

• Capacitance & Voltage: 100 µF rated at 50 V for bulk energy storage and decoupling in power circuits.
• Low Impedance Performance: Specified impedance of 340 mΩ to reduce voltage ripple and improve transient response.
• Temperature & Lifetime: Wide operating range −55 °C to +105 °C with a rated lifetime of 5000 hours at 105 °C.
• Ripple Current Capability: Supports 300 mA at 120 Hz and 450 mA at 10 kHz, enabling effective AC ripple handling across low and high frequencies.
• Package & Mounting: Chip‑type radial can in an SMD form factor, sized L: 1.0 cm × D: 0.8 cm with a recommended land size of 8.3 × 8.3 mm; compatible with automated placement using carrier tape.
• Reliability & Compliance: AEC‑Q200 qualified and RoHS compliant; leakage current guaranteed to be ≤ 0.01 CV or 3 µA (whichever is greater) after 2 minutes at 20 °C.
• Polarized Construction & Tolerance: Polarized electrolytic capacitor with capacitance tolerance of −20% to +20%.

Typical Applications

• Automotive electronics: Power smoothing and decoupling in control modules and power electronics where AEC‑Q200 qualification and high temperature endurance are required.
• Power supply filtering: Bulk decoupling and ripple suppression for DC‑DC converters and voltage regulators across low and high ripple frequencies.
• High‑density SMD designs: Surface‑mount form factor suited to compact PCBs that require automated carrier‑tape assembly.
• Thermally demanding environments: Systems operating across −55 °C to +105 °C where long‑term stability (5000 h at 105 °C) is important.

Unique Advantages

• AEC‑Q200 Qualification: Offers a documented level of automotive reliability for designs that require automotive‑grade components.
• Low impedance and measurable ripple handling: 340 mΩ impedance plus 300 mA/450 mA ripple ratings reduce output voltage ripple and support transient loads.
• Compact SMD chip construction: Radial can SMD package optimizes board area for high‑density assemblies and supports automated placement via carrier tape.
• High temperature endurance: Rated for 5000 hours at 105 °C, providing predictable performance in prolonged elevated‑temperature duty.
• Controlled leakage and tolerance: Leakage current is limited to 0.01 CV or 3 µA after 2 minutes at 20 °C, with capacitance tolerance ±20% for reliable design margins.
• Regulatory compliance: RoHS compliance supports use in regions and products requiring restricted substance adherence.

Why Choose UUD1H101MNL1GS?

UUD1H101MNL1GS combines a compact chip‑type SMD package with low impedance, robust ripple capability, and automotive‑grade qualification to address power filtering and decoupling needs in temperature‑stressed, high‑reliability designs. Its specifications—100 µF at 50 V, −55 °C to +105 °C operation, and 5000‑hour endurance at 105 °C—make it well suited for engineers designing automotive electronics, power modules, and other systems demanding long‑term stability.

The part offers clear, verifiable electrical and mechanical parameters for predictable BOM integration and automated assembly, backed by AEC‑Q200 qualification and RoHS compliance for regulated environments.

Request a quote or submit an inquiry for UUD1H101MNL1GS to receive pricing, lead‑time, and sample information for evaluation and production planning.