UUD1E560MCL1GS

The UUD1E560MCL1GS is a surface-mount aluminum electrolytic capacitor in Nichicon’s UUD series, designed as a chip-type, low-impedance part for compact PCB power applications. It provides 56 µF capacitance at a 25 V rating with a wide operating temperature range and features aimed at high-density, automated assembly.

Key value propositions include low loss (tan δ = 0.14 at 120 Hz, 20 °C), defined ripple current capability across low and high frequencies, and endurance validated for elevated-temperature operation.

Key Features

• Capacitance & Voltage — 56 µF nominal capacitance with a 25 V rated voltage and ±20% tolerance for predictable DC bus and decoupling behavior.
• Low Loss / Low Impedance — tan δ of 0.14 (measured at 120 Hz, 20 °C) and specified impedance of 440 mΩ, supporting efficient energy storage and reduced heating in power circuits.
• Frequency-graded Ripple Performance — Low-frequency ripple current of 230 mA at 120 Hz and high-frequency ripple current of 345 mA at 10 kHz to address both mains-frequency and switching noise filtering.
• Robust Temperature & Endurance — Operating range −55 °C to +105 °C with a rated endurance of 2000 hours at 105 °C, suitable for sustained elevated-temperature operation.
• Compact SMD Package — Chip-type radial can SMD in φ6.3 × 5.8 mm size with a recommended land pattern of 6.6 × 6.6 mm for high-density PCB layouts.
• Automotive-Grade Reliability — AEC-Q200 qualified and RoHS compliant, supporting automotive and other demanding applications that require component qualification.
• Assembly-Ready Packaging — Supplied in embossed carrier taping for compatibility with automatic placement equipment and high-volume production.

Typical Applications

• Automotive Electronics — Suitable for electronic control modules and other in-vehicle systems where AEC-Q200 qualification and −55 °C to +105 °C operation are required.
• High-Density SMD Power Modules — Compact chip form factor and low impedance make it appropriate for localized decoupling and filtering on densely populated PCBs.
• Automated Manufacturing — Embossed carrier taping and SMD can construction enable efficient placement in automated production lines.

Unique Advantages

• Verified Endurance at Elevated Temperature — 2000 hours at 105 °C provides a measurable reliability baseline for thermal-stressed designs.
• Frequency-Responsive Ripple Handling — Separate ripple current specs for 120 Hz and 10 kHz allow designers to evaluate performance across power-source and switching conditions.
• Compact Footprint for High-Density Boards — φ6.3 × 5.8 mm package and small recommended land size aid in saving board area without sacrificing capacitance.
• Automotive-Grade Qualification — AEC-Q200 qualification supports use in applications requiring recognized component-level automotive robustness.
• Manufacturing-Friendly Packaging — Embossed carrier taping minimizes handling risk and speeds integration into automated assembly processes.
• Regulatory Compliance — RoHS compliance supports environmentally regulated product development and supply chains.

Why Choose UUD1E560MCL1GS?

The UUD1E560MCL1GS positions itself as a compact, qualified SMD electrolytic capacitor for designs that demand low impedance, measurable ripple performance, and endurance at elevated temperatures. Its chip-type can package and embossed carrier taping make it practical for high-density boards and automated assembly workflows.

This part is suited for engineers and procurement teams developing robust power subsystems — especially in applications demanding AEC-Q200 qualification and a clear, testable specification set for ripple, leakage, and lifetime at 105 °C. Choosing this capacitor supports predictable thermal performance and streamlined manufacturing integration.

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