UUD1E331MNL1GS

The UUD1E331MNL1GS is a chip-type aluminum electrolytic capacitor from Nichicon's UUD series designed for surface-mount use. It delivers 330 µF at 25 V in a compact φ8 × 10 mm SMD can with embossed carrier taping for automated placement.

Built for demanding thermal and reliability environments, this part offers low impedance, defined ripple-handling capability and AEC-Q200 qualification, making it suitable for automotive electronics and high-density PCB assemblies.

Key Features

• Electrical Performance — Rated capacitance 330 µF at 25 V with ±20% tolerance (120 Hz, 20°C); low impedance of 170 mΩ and tan δ ≈ 0.16 for stable AC behavior at 120 Hz.
• Leakage & Ripple Handling — Specified leakage current of 82.5 µA and ripple current ratings of 450 mA at 120 Hz and 675 mA at 10 kHz to support power-filtering and decoupling tasks.
• Thermal & Reliability — Wide operating range from −55°C to +105°C and endurance rated for 5000 hours at 105°C, supporting long-term operation in elevated-temperature environments.
• Automotive-Grade Qualification — AEC-Q200 rating and explicit application for automotive use in the product data, indicating suitability for vehicle electronics where that qualification is required.
• Compact SMD Package — φ8 × 10 mm radial can packaged for surface mount use with recommended land size 8.3 × 8.3 mm, enabling high-density PCB layouts.
• Assembly-Ready Packaging — Supplied in embossed carrier taping for automated mounting machines, streamlining high-volume production workflows.
• Environmental Compliance — RoHS compliant per the product data.

Typical Applications

• Automotive electronics — Use in vehicle control modules and electronic subsystems where AEC-Q200 qualification and wide temperature operation are required.
• High-density PCB assemblies — Surface-mount chip form factor and compact footprint make it suitable for space-constrained board designs.
• Automated production lines — Embossed carrier taping supports placement by automatic mounting machines for efficient manufacturing.

Unique Advantages

• AEC-Q200-qualified reliability: Explicit AEC-Q200 rating in the product data supports use in applications requiring automotive-grade component qualification.
• High-temperature endurance: Rated for operation to +105°C with a 5000-hour endurance at 105°C, enabling prolonged service in elevated-temperature environments.
• Low impedance and measurable damping: 170 mΩ impedance and tan δ ≈ 0.16 provide predictable AC performance for power smoothing and decoupling.
• Defined ripple capability: Ripple current specs of 450 mA (120 Hz) and 675 mA (10 kHz) give clear selection criteria for power-management designs.
• Compact, assembly-friendly package: φ8 × 10 mm SMD can with embossed carrier taping simplifies placement in automated, high-density manufacturing processes.
• Regulatory compliance: RoHS compliance minimizes environmental and regulatory risk for product deployment.

Why Choose UUD1E331MNL1GS?

UUD1E331MNL1GS combines a compact SMD can, low impedance characteristics, and clearly specified ripple and leakage figures to meet the demands of temperature-stressed, high-reliability designs. The AEC-Q200 qualification and 5000-hour endurance at 105°C make it a fit for automotive electronics and other applications that require validated long-term performance.

Its embossed carrier taping and surface-mount package support efficient automated assembly and high-density PCB layouts, delivering practical production and design benefits while maintaining environmental compliance.

Request a quote or contact sales to discuss availability, pricing, and how UUD1E331MNL1GS can be integrated into your next design.