UUD1E330MCL1GS

The UUD1E330MCL1GS is a surface-mount, chip-type aluminum electrolytic capacitor from Nichicon’s UUD series designed for low-impedance applications on high-density PC boards. It combines a compact φ6.3 × 5.8 mm can-style SMD package with performance characteristics targeted at robust power decoupling and ripple handling.

Key value propositions include low impedance (440 mΩ), a wide operating temperature range from −55°C to 105°C, AEC‑Q200 qualification for demanding applications, and packaging optimized for automated assembly via embossed carrier taping.

Key Features

• Capacitance and Tolerance: 33 µF nominal capacitance with ±20% tolerance (measured at 120 Hz, 20°C).
• Rated Voltage: 25 V rated voltage suitable for a range of low-voltage power rails.
• Low Impedance Performance: Specified impedance of 440 mΩ and tanδ (DF) of 0.14 measured at 20°C, 120 Hz for improved AC performance.
• Ripple Current Capability: Low-frequency ripple current 230 mA at 120 Hz and high-frequency ripple current 345 mA at 10 kHz to support dynamic supply conditions.
• Leakage Current: Leakage current specified as 8.25 µA.
• High-Temperature Endurance: Rated for operation from −55°C to 105°C with an endurance rating of 2000 hours at 105°C.
• Compact SMD Package: Chip-type radial can (SMD) in φ6.3 × 5.8 mm size with recommended land size 6.6 × 6.6 mm for high-density PCB layouts.
• Automated Assembly Ready: Supplied in embossed carrier taping for compatibility with automatic mounting equipment.
• Quality and Compliance: AEC‑Q200 qualified and RoHS compliant.
• Identification: Black print marking on the case top for easy part identification.

Typical Applications

• Automotive Electronics: AEC‑Q200 qualification and 105°C endurance make the part suitable for automotive control modules and electronic subsystems requiring reliable decoupling and smoothing.
• High-Density Surface-Mount Power Boards: Chip-type low-impedance construction and compact φ6.3 × 5.8 mm package support decoupling on densely populated PCBs.
• Automated High-Volume Assembly: Embossed carrier taping enables efficient placement in automated production lines for volume manufacturing.

Unique Advantages

• Compact footprint with strong performance: Small φ6.3 × 5.8 mm SMD can delivers 33 µF capacitance while minimizing board area.
• Low-impedance AC behavior: 440 mΩ impedance and tanδ 0.14 at 120 Hz reduce voltage ripple and improve transient response on power rails.
• Dual-frequency ripple capability: Specified ripple currents at 120 Hz and 10 kHz provide measurable performance across common power-supply frequencies.
• High-temperature endurance: Rated for −55°C to 105°C with 2000 hours endurance at 105°C for demanding thermal environments.
• Production-ready packaging: Embossed carrier tape enables straightforward integration into automated pick-and-place assembly flows.
• Industry compliance: AEC‑Q200 qualification and RoHS compliance support use in regulated and conservative design environments.

Why Choose UUD1E330MCL1GS?

The UUD1E330MCL1GS targets designs that require a compact, low-impedance aluminum electrolytic capacitor with proven thermal endurance and production-friendly packaging. Its combination of 33 µF capacitance, 25 V rating, measurable ripple current capability, and AEC‑Q200 qualification positions it for applications where reliability, repeatable performance, and automated assembly are priorities.

Backed by Nichicon’s UUD chip-type series, this part is suitable for engineers specifying capacitors for high-density power decoupling, automotive electronics, and other assemblies needing a stable, solderable SMD aluminum solution with defined electrical and environmental characteristics.

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