UUD1H220MCL1GS

The UUD1H220MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface mounting on high-density printed circuit boards. Built for automated production, it is compatible with carrier-tape fed placement and is AEC-Q200 qualified with RoHS compliance for automotive and other demanding applications.

Key electrical and mechanical characteristics include 22 µF capacitance at 50 V, a compact 5.8 × 6.3 mm footprint, and an operating temperature range of −55 °C to +105 °C, with rated lifetime of 2000 hours at 105 °C for this package size.

Key Features

• Electrical Performance — 22 µF nominal capacitance at 50 V with a capacitance tolerance of −20% to +20% and a specified impedance of 880 mΩ.
• Ripple Current Ratings — Rated ripple current of 165 mA at 120 Hz and 247.5 mA at 10 kHz, provided for system-level thermal and filtering considerations.
• Temperature and Reliability — Operates from −55 °C to +105 °C and is specified for 2000 hours at 105 °C for this package, supporting sustained operation in elevated-temperature environments.
• Automotive Qualification — AEC-Q200 qualified, enabling use in automotive electronics where that qualification is required.
• Package and Mounting — Chip-type radial can SMD package (L: 5.8 × D: 6.3 mm) with a recommended PCB land size of 6.6 × 6.6 mm; designed for surface mounting on high-density PCBs.
• Manufacturing Compatibility — Applicable to automatic mounting machines and carrier-tape fed placement to support high-volume assembly.
• Regulatory Compliance — RoHS compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics — Suitable for automotive modules and systems where AEC-Q200 qualification and high-temperature endurance are required.
• High-Density PCB Assemblies — Compact chip-type SMD package designed to save board space on dense layouts.
• Automated Production Lines — Carrier-tape compatibility and surface-mount design simplify integration into automated placement processes.

Unique Advantages

• Low-Impedance Design: Specified impedance of 880 mΩ supports stable performance in circuits that benefit from reduced ESR.
• Wide Temperature Range: Rated from −55 °C to +105 °C with a documented 2000-hour endurance at 105 °C for the package size, providing predictable behavior in elevated temperatures.
• Automotive-Ready Qualification: AEC-Q200 qualification supports use in applications with automotive reliability requirements.
• Compact SMD Footprint: 5.8 × 6.3 mm package and 6.6 × 6.6 mm recommended land pattern enable use on space-constrained, high-density boards.
• Production-Friendly Packaging: Designed for carrier-tape fed automatic mounting machines to streamline high-volume assembly.
• Regulatory Compliance: RoHS conformity facilitates deployment in regulated manufacturing environments.

Why Choose UUD1H220MCL1GS?

The UUD1H220MCL1GS combines low-impedance electrical performance with a compact SMD chip package and assembly-friendly features to meet the needs of demanding electronic designs. Its AEC-Q200 qualification, wide operating temperature range, and specified life at elevated temperature make it a suitable choice for applications requiring robust, repeatable performance under thermal stress.

This part is well suited for engineers and procurement teams specifying components for automotive-grade and high-density PCB assemblies where automated placement, RoHS compliance, and predictable endurance are important selection criteria.

Request a quote or contact sales to discuss pricing, availability, and lead times for the UUD1H220MCL1GS.