UUD1H2R2MCL1GS

The UUD1H2R2MCL1GS is a chip-type aluminum electrolytic capacitor from the Nichicon UUD series, engineered for surface-mount use on high‑density PC boards. It delivers a 2.2 µF capacitance at a 50 V rating with a low-impedance construction and is designed for automated carrier-tape mounting.

Built for demanding environments, this part is AEC‑Q200 qualified and RoHS compliant, with an operating temperature range from -55 °C to +105 °C and specified lifetime performance at elevated temperature.

Key Features

• Electrical Performance — 2.2 µF nominal capacitance with a 50 V rated voltage and ±20% tolerance; low-impedance construction specified at 5 Ω.
• Ripple Handling — Rated ripple current of 30 mA at 120 Hz and 45 mA at 10 kHz for filtering and decoupling in board-level power networks.
• Thermal and Lifetime — Category temperature range −55 °C to +105 °C with a specified endurance of 2000 hours at 105 °C.
• Reliability & Qualification — AEC‑Q200 qualified to support automotive-grade reliability requirements; series-level endurance, soldering-heat and shelf-life characteristics are defined in the UUD datasheet.
• Mounting & Packaging — Chip-type, can-style SMD package suitable for surface mounting on high-density PCBs; compatible with automatic mounting machines fed by carrier tape.
• Environmental Compliance — Compliant with the RoHS directive (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive electronics — Intended for use in automotive systems that require AEC‑Q200 qualified surface-mount capacitors and reliable operation across −55 °C to +105 °C.
• High-density SMD assemblies — Designed for surface mounting on high-density printed circuit boards and compatible with carrier-tape automated placement.
• Automated production environments — Package and tape-feed compatibility make it suitable for high-volume assembly lines that use automatic mounting machines.

Unique Advantages

• AEC‑Q200 qualification: Provides documented series-level qualification for automotive-grade reliability where AEC compliance is required.
• Wide operating temperature range: Rated from −55 °C to +105 °C to support electronics exposed to broad thermal conditions.
• Low-impedance design: Specified impedance of 5 Ω and low-loss characteristics support effective smoothing and decoupling on power rails.
• Automated assembly ready: Chip-type SMD format and carrier-tape compatibility simplify integration into automated pick-and-place workflows.
• Defined high-temperature lifetime: Rated for 2000 hours at 105 °C, enabling predictable long-term performance in elevated-temperature applications.
• Regulatory compliance: RoHS compliant to meet environmental and regulatory requirements.

Why Choose UUD1H2R2MCL1GS?

UUD1H2R2MCL1GS combines a compact chip-type SMD package with low-impedance electrical performance, making it suitable for surface-mount applications where board space, automated assembly and thermal endurance matter. Its AEC‑Q200 qualification and RoHS compliance position it for use in automotive and other high-reliability sectors that require documented component-level qualifications.

This part is a practical choice for engineering teams designing compact, automotive-grade and high-density SMD systems that need predictable ripple handling, temperature tolerance, and compatibility with automated production processes.

Request a quote or submit an inquiry for pricing and availability to evaluate UUD1H2R2MCL1GS for your next design.