UUG0J332MNJ1MS

CAP ALUM 3300UF ±20% 6.3V SMD
Part Description

3300 µF 6.3 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 1,952 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUUG
ManufacturerNichicon
Manufacturing StatusEnd Of Life
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotiveCapacitance3.3 mFECCNEAR99
ESRN/AHeight Seated (Max)1.75 cmHTS Code8532.22.0020
ImpedanceN/ALead SpacingN/ALifetime @ Temp2000 h @ 85°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-40°C - 85°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency1.38 A @ 10 kHzRipple Current Low Frequency1.2 A @ 120 Hz
RoHS ComplianceCompliantSize / Dimension16.5 x 16 mmSurface Mount Land Size16.3 x 16.3 mm
Tolerance-20%~20%Voltage6.3 V

Overview of UUG0J332MNJ1MS – Surface‑Mount Aluminum Electrolytic Capacitor, 3300 µF, 6.3 V

The UUG0J332MNJ1MS from Nichicon is a surface‑mount aluminum electrolytic capacitor in the UUG series, offering a high 3300 µF capacitance in a compact φ16 × 16.5 mm SMD can. It is designed for applications requiring bulk energy storage and high ripple handling in a surface‑mount package.

Key electrical characteristics include a rated voltage of 6.3 V, capacitance tolerance of ±20%, measured tanδ of 0.32 (20°C, 120 Hz), and a rated operating temperature range of −40°C to +85°C. Status: End Of Life.

Key Features

  • High Capacitance — 3300 µF nominal capacitance with ±20% tolerance, providing bulk energy storage in a compact chip form.
  • Rated Voltage — 6.3 V rated voltage suitable for low‑voltage power rails.
  • Low‑frequency and High‑frequency Ripple Handling — Rated ripple current of 1.2 A at 120 Hz and 1.38 A at 10 kHz to support both power supply smoothing and higher frequency decoupling.
  • Loss Characteristics — Tangent of loss angle (tanδ) 0.32 measured at 20°C, 120 Hz, enabling predictable AC loss behavior in designs.
  • Leakage Current — Specified leakage current of 623.7 µA for predictable standby loss and charge retention planning.
  • Automotive‑grade Reliability — AEC‑Q200 rating and endurance specification of 2000 hours at 85°C (capacitance change within ±20% and tanδ ≤ 200% of initial), supporting demanding environmental cycles.
  • Compact Surface‑Mount Package — φ16 × 16.5 mm radial can SMD package (case size 16 mm × 16.5 mm) with embossed carrier taping for automated placement; polarized design for correct orientation in boards.
  • Wide Temperature Range — Rated for operation from −40°C to +85°C to match common embedded and automotive ambient conditions.

Typical Applications

  • Automotive power systems — Bulk smoothing and energy buffering on low‑voltage rails in automotive electronics where AEC‑Q200 qualification is required.
  • Power supply decoupling — Bulk decoupling for DC/DC converters and power rails that need high capacitance and elevated ripple current capability.
  • Embedded and industrial electronics — Energy storage and smoothing in compact SMD layouts operating across −40°C to +85°C.

Unique Advantages

  • High capacitance in an SMD can — 3300 µF in a φ16 × 16.5 mm footprint reduces board area compared with larger through‑hole options while keeping bulk energy on board.
  • Designed for ripple loading — Dual ripple ratings (120 Hz and 10 kHz) give designers predictable thermal and lifetime behavior across frequencies commonly encountered in power electronics.
  • Automotive‑focused reliability — AEC‑Q200 rating and a 2000‑hour endurance at 85°C provide measurable durability for automotive and harsh‑environment applications.
  • Production‑ready packaging — Embossed carrier taping supports automated pick‑and‑place assembly for high‑volume manufacturing.
  • Clear end‑of‑life transparency — Part status marked End Of Life, enabling proactive design continuity and sourcing decisions.

Why Choose UUG0J332MNJ1MS?

The UUG0J332MNJ1MS combines high bulk capacitance, robust ripple current capability, and automotive‑grade endurance in a compact surface‑mount aluminum electrolytic package. It is suited to designs that require predictable performance over temperature and frequency, particularly where a high capacitance density and automated assembly are priorities.

This part is appropriate for engineers and purchasing teams building or maintaining low‑voltage power systems, power supply modules, and automotive electronics that need a qualified, high‑capacitance SMD solution with documented endurance and handling characteristics.

Request a quote or submit an inquiry for availability, lead time, and ordering information for UUG0J332MNJ1MS.

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    Date Founded: 1950


    Headquarters: Nakagyo, Kyoto, Japan


    Employees: 5,000+


    Revenue: $1.2 Billion


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