UUG0J332MNQ1MS

The UUG0J332MNQ1MS is a surface-mount aluminum electrolytic capacitor from Nichicon’s UUG series, offering a high-capacitance chip-type solution in a compact SMD can. It provides 3300 µF at 6.3 V with performance and form-factor targeted toward applications that require large capacitance in a board-mounted package.

Key attributes include AEC-Q200 rating, specified endurance at elevated temperature, explicit ripple-current specifications at low and high frequency, and embossed carrier taping for pick-and-place assembly.

Key Features

• Capacitance & Voltage — 3300 µF nominal capacitance at a rated voltage of 6.3 V with tolerance ±20% (120 Hz, 20 °C).
• Loss and DF — Tangent of loss angle (tan δ) specified at 0.32 under measurement conditions of 20 °C, 120 Hz.
• Ripple Current Capability — Low-frequency ripple current 1.2 A (120 Hz) and high-frequency ripple current 1.38 A (10 kHz), with frequency coefficients provided in the UUG series data.
• Leakage Current — Specified leakage current of 623.7 µA (measured after 1 minute at 20 °C).
• Reliability & Endurance — Endurance rating of 2000 hours at 85 °C with capacitance change within ±20% and tan δ within 200% of initial specified value after the test.
• Operating Range — Rated for operation from −40 °C to +85 °C.
• Package & Assembly — Radial can SMD package, case size φ16×16.5 mm, surface-mount land size L:1.63×W:1.63 cm, supplied in embossed carrier taping for automated placement.
• Automotive-Grade Rating — AEC-Q200 rated per product specifications.
• Lifecycle Status — Product status: End Of Life.

Typical Applications

• Automotive electronics — AEC-Q200 rating and specified endurance at 85 °C make this capacitor suitable for automotive circuit designs that call for board-mounted, high-capacitance components.
• Compact high-capacitance SMD designs — 3300 µF in a φ16×16.5 mm can provides substantial capacitance where board space is constrained.
• Automotive power modules and control boards — Ripple current specifications at both low and high frequency support use in modules and boards that require defined AC current handling in an SMD form factor.

Unique Advantages

• Large capacitance in an SMD can — 3300 µF capacity delivers bulk energy storage while preserving board real estate with a φ16×16.5 mm package.
• Frequency-aware ripple performance — Separate ripple current specs for low (120 Hz) and high (10 kHz) frequencies allow designers to match component selection to system ripple conditions.
• Automotive-grade qualification — AEC-Q200 rating provides an explicit qualification level for applications requiring that class of component verification.
• High-temperature endurance specified — 2000 hours at 85 °C gives a clear reliability baseline for thermal-stressed designs.
• Pick-and-place ready — Embossed carrier taping and defined surface-mount land size streamline automated assembly integration.

Why Choose UUG0J332MNQ1MS?

UUG0J332MNQ1MS is positioned for designs that need substantial capacitance in a compact surface-mount package while retaining defined ripple-current handling and endurance at elevated temperature. With explicit leakage, tan δ, and ripple-current specifications, it offers measurable, engineering-ready parameters for system design and validation.

This part is especially relevant for engineers specifying AEC-Q200-rated components and for boards where SMD assembly and automated placement are required. Note the product is listed as End Of Life; verify availability and recommended alternatives when planning production designs.

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