UUG1H331MNQ1MS

The UUG1H331MNQ1MS is a chip-type aluminum electrolytic capacitor from Nichicon’s UUG series, providing 330 µF capacitance at a 50 V rating in a compact surface-mount can (φ12.5 × 13.5 mm). It targets applications that require higher capacitance in an SMD form factor with defined ripple and endurance characteristics.

Key delivered performance includes specified ripple current values at low and high frequencies, a rated operating temperature range of −40°C to 85°C, and a 2000 hour endurance at 85°C. Note: this part is listed as Not Recommended for New Designs.

Key Features

• Capacitance & Tolerance — 330 µF nominal capacitance with ±20% tolerance (measured at 120 Hz, 20°C).
• Rated Voltage & Polarization — 50 V rated voltage; polarized aluminum electrolytic construction for DC applications.
• Ripple Current Performance — Low-frequency ripple current 520 mA at 120 Hz and high-frequency ripple current 780 mA at 10 kHz, providing defined ripple handling across frequencies.
• Leakage Current — Specified leakage current of 495 µA.
• Endurance — 2000 hours life/endurance at 85°C with capacitance change within ±20% and tan δ within specified limits after recovery to 20°C.
• Temperature Range — Rated for operation from −40°C to +85°C.
• Package & Mounting — Chip-type surface-mount radial can, size φ12.5 × 13.5 mm (L: 13.5 × D: 12.5 mm) with embossed carrier taping for automated placement.
• Qualification — AEC-Q200 rated, suitable for designs requiring that qualification level.

Typical Applications

• Automotive systems — AEC-Q200 rating and −40°C to 85°C operation make this capacitor suitable for automotive electronic modules.
• Surface-mount power modules — Chip package and embossed carrier taping support automated PCB assembly in power supply modules.
• High-capacitance SMD designs — Provides higher capacitance in a compact can-style SMD footprint where space and capacitance density are required.

Unique Advantages

• High capacitance in an SMD can — 330 µF in a φ12.5 × 13.5 mm chip package enables significant bulk capacitance without through-hole components.
• Defined ripple performance across frequencies — Specified ripple currents at 120 Hz and 10 kHz help designers manage AC stress in both low- and high-frequency circuits.
• Automotive-grade qualification — AEC-Q200 rating supports use in designs that require that level of component qualification.
• Long endurance at elevated temperature — 2000 hours at 85°C provides a measurable lifetime metric for thermal stress planning.
• Manufacturing-ready packaging — Embossed carrier taping simplifies pick-and-place for high-volume assembly.

Why Choose UUG1H331MNQ1MS?

The UUG1H331MNQ1MS delivers a combination of high capacitance, defined ripple handling, and AEC-Q200 qualification in a chip-type surface-mount can. Its specified performance—330 µF at 50 V, ripple current ratings at multiple frequencies, leakage current spec, and a 2000 hour endurance at 85°C—makes it a clear choice when designers need verifiable electrical and thermal characteristics for demanding assemblies.

This part is well suited to engineers and procurement teams designing compact, high-capacitance SMD power modules and automotive electronics that require components with documented ripple, leakage, and lifetime specifications. Be aware that this specific part is Not Recommended for New Designs.

If you would like pricing, availability, or a formal quote for UUG1H331MNQ1MS, please request a quote or contact sales to submit your requirements and receive further information.