UUG1H471MNJ1MS

CAP ALUM 470UF ±20% 50V SMD
Part Description

470 µF 50 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 1,671 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUUG
ManufacturerNichicon
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotiveCapacitance470 µFECCNEAR99
ESRN/AHeight Seated (Max)1.75 cmHTS Code8532.22.0020
ImpedanceN/ALead SpacingN/ALifetime @ Temp2000 h @ 85°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-40°C - 85°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency1.11 A @ 10 kHzRipple Current Low Frequency740 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension16.5 x 16 mmSurface Mount Land Size16.3 x 16.3 mm
Tolerance-20%~20%Voltage50 V

Overview of UUG1H471MNJ1MS – Aluminum Electrolytic Chip Capacitor, 470 µF 50 V, Surface Mount

The UUG1H471MNJ1MS is a chip-type aluminum electrolytic capacitor in Nichicon's UUG series, offering 470 µF capacitance at a 50 V rating in a compact surface-mount can (φ16 × 16.5 mm). It delivers high bulk capacitance in a board-friendly SMD package suited for designs that require robust energy storage and smoothing in compact footprints.

Designed and produced for automotive electronics, the part carries AEC‑Q200 rating and is available in embossed carrier taping for high-volume surface-mount assembly.

Key Features

  • Capacitance & Voltage — 470 µF nominal capacitance with a 50 V rated voltage and tolerance of ±20% (measured at 120 Hz, 20°C).
  • Package & Mounting — Chip-type aluminum electrolytic can for surface-mount assembly; case size φ16 × 16.5 mm and packaged in embossed carrier taping for automated placement.
  • Temperature Range & Endurance — Rated operating range −40°C to +85°C with endurance specified as 2000 hours at 85°C under rated voltage.
  • Ripple Current Performance — Low-frequency ripple current 740 mA at 120 Hz and high-frequency ripple capability listed at 1110 mA (product specification), supporting both low- and high-frequency decoupling needs.
  • Leakage & Dissipation — Leakage current specified as 705 µA (measured at 20°C after 1 minute); tangent of loss angle (tan δ) 0.12 at 20°C, 120 Hz for the 50 V rating.
  • Reliability & Qualification — AEC‑Q200 rated for automotive-grade stress screening and supplied as a mass-production product.

Typical Applications

  • Automotive systems — AEC‑Q200 rating and chip SMD packaging make this capacitor suitable for automotive electronic modules requiring compact bulk capacitance and reliable endurance at elevated temperature.

Unique Advantages

  • High bulk capacitance in a compact chip package — 470 µF in a φ16 × 16.5 mm can provides substantial energy storage while minimizing board area.
  • Automotive-grade qualification — AEC‑Q200 rating supports use in designs that require established component-level stress screening.
  • Wide operating temperature and proven endurance — −40°C to +85°C range with 2000 hours endurance at 85°C under rated voltage provides predictable performance over time.
  • Dual-frequency ripple handling — Specified ripple current at both low (740 mA at 120 Hz) and high frequencies (1110 mA at product-specified high frequency) allows use across a range of switching and line-frequency conditions.
  • Production-ready packaging — Embossed carrier taping and mass-production status simplify procurement and placement in automated SMT lines.
  • Known electrical loss and leakage characteristics — tan δ (0.12 at 20°C, 120 Hz) and measured leakage current provide clear parameters for design margining.

Why Choose UUG1H471MNJ1MS?

The UUG1H471MNJ1MS is positioned for engineers who need substantial bulk capacitance and reliable, qualified performance in a surface-mount form factor. With a 50 V rating, defined leakage and dissipation characteristics, and endurance specified at 85°C, this capacitor is suitable for compact power modules and automotive electronic assemblies that require repeatable behavior under temperature and ripple stress.

Available in embossed carrier taping and delivered as a mass-production item, the part supports automated assembly and volume deployment while providing the traceable qualification engineers expect for demanding system designs.

To request a quote or discuss volume pricing and lead times, please contact sales with your part number and application details.

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