UWH1V330MCL1GS

The UWH1V330MCL1GS is a chip‑type aluminum electrolytic capacitor designed for surface‑mount assembly and high‑reliability applications. It provides 33 µF capacitance at 35 V in a compact φ8 × 6.2 mm SMD can and is qualified to AEC‑Q200 for demanding environments.

This part targets systems that require stable capacitance and endurance at elevated temperatures, with a rated operating range of −40 °C to +125 °C and support for 260 °C peak reflow soldering for automated assembly processes.

Key Features

• Capacitance & Voltage — 33 µF rated capacitance with 35 V rated voltage and ±20% tolerance (at 120 Hz, 20 °C) for general decoupling and energy‑storage needs.
• High‑Temperature Operation — Specified for operation from −40 °C to +125 °C with endurance of 1000 hours at 125 °C.
• Reflow Compatibility — Compatible with 260 °C peak reflow soldering (recommended reflow: 260 °C peak, 5 s), enabling automated PCB assembly from embossed carrier taping.
• Reliability & Qualification — AEC‑Q200 qualified and mass‑production status for use in applications that require automotive‑grade screening.
• Ripple and Leakage Characteristics — Low‑frequency ripple current 44 mA at 120 Hz and high‑frequency ripple current 66 mA at 10 kHz; leakage current listed as 34.65 µA.
• Package & Mounting — φ8 × 6.2 mm radial can SMD (L: 6.2 mm × D: 8 mm) with recommended PCB land 8.3 × 8.3 mm and embossed carrier taping for pick‑and‑place.
• Loss Tangent (tan δ) — tan δ (max.) for 35 V rating is 0.18 measured at 120 Hz, 20 °C, giving a documented dissipation characteristic for AC performance budgeting.
• Compliance — RoHS compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics — AEC‑Q200 qualification and +125 °C endurance make this capacitor suitable for vehicle electronic modules requiring surface‑mount electrolytic capacitance.
• High‑Temperature Electronics — Designed for systems that must withstand elevated operating temperatures while retaining capacitance and leakage performance.
• Automated PCB Assembly — Embossed carrier taping and 260 °C peak reflow compatibility enable efficient pick‑and‑place assembly for volume production.

Unique Advantages

• Automotive‑grade Qualification: AEC‑Q200 listing provides documented screening appropriate for automotive and other high‑reliability programs.
• High‑temperature Endurance: Rated for 1000 hours at 125 °C to support designs that require long‑term stability in hot environments.
• Reflow‑ready Design: Supports 260 °C peak reflow soldering, simplifying integration into standard SMT assembly lines.
• Compact SMD Can: φ8 × 6.2 mm package delivers 33 µF capacitance in a small footprint with recommended PCB land pattern for automated placement.
• Documented AC Performance: Specified ripple currents at 120 Hz and 10 kHz and tan δ values allow accurate thermal and performance margin planning.
• Regulatory Compliance: RoHS conformity reduces environmental/handling concerns for production and procurement.

Why Choose UWH1V330MCL1GS?

UWH1V330MCL1GS combines a compact surface‑mount aluminum electrolytic form factor with AEC‑Q200 qualification and high‑temperature endurance to serve applications that demand robust, reliable capacitance up to +125 °C. Its 35 V rating, specified ripple currents, and measured tan δ support predictable AC behavior in thermal and power management designs.

This part is well suited to engineers and procurement teams designing for automotive and other high‑reliability systems that require reflow‑compatible assembly, RoHS compliance, and documented endurance data from the manufacturer.

If you need pricing, availability, or a formal quote for UWH1V330MCL1GS, request a quote or submit an inquiry with your quantity and delivery requirements and our team will respond with current lead time and commercial details.