UWJ0J101MCL1GB

The UWJ0J101MCL1GB is a Nichicon UWJ series surface-mount aluminum electrolytic capacitor in a compact chip can package. It provides 100 µF capacitance at a 6.3 V rating and is designed for automated placement on high‑density PCBs.

Engineered for reliability in temperature‑sensitive applications, this part supports AEC‑Q200 qualification, a wide operating temperature range of −40 °C to 85 °C, and a rated load life of 2000 hours at 85 °C.

Key Features

• Capacitance & Voltage — 100 µF nominal capacitance with a 6.3 V rated voltage and ±20% tolerance, suitable for low‑voltage rail decoupling and bulk storage.
• Compact Chip Package — Chip can package with dimensions L: 5.4 × D: 6.3 mm and nominal 5.5 mm height for space‑constrained surface‑mount designs.
• Surface Mount & Assembly — Designed for surface mounting on high‑density PCBs and compatible with automatic mounting machines fed with carrier tape.
• 260 °C Reflow Compatibility — Corresponds with 260 °C peak reflow soldering (recommended: 260 °C peak 5 s; 230 °C over 60 s, two passes), enabling standard lead‑free SMT processes.
• Automotive Grade Reliability — AEC‑Q200 compliant with a specified load life of 2000 hours at 85 °C and an operating temperature range of −40 °C to 85 °C.
• Electrical Performance — Low‑frequency ripple current: 70 mA at 120 Hz; high‑frequency ripple current: 105 mA at 10 kHz; leakage current specified as ≤0.01CV or 3 µA (whichever is greater).
• RoHS Compliant — Meet RoHS directive requirements (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive electronic modules — Suitable for surface‑mount use on automotive PCBs that require AEC‑Q200 components and operation from −40 °C to 85 °C.
• PCB power decoupling — Provides bulk capacitance and ripple handling for low‑voltage (6.3 V) power rails in compact assemblies.
• High‑density board designs — Compact chip can package enables use in space‑constrained, automated SMT assembly lines on densely populated PCBs.

Unique Advantages

• Designed for lead‑free reflow — Certified for 260 °C peak reflow processes, simplifying integration into standard Pb‑free manufacturing flows.
• Automotive‑grade reliability — AEC‑Q200 compliance and a 2000‑hour load life at 85 °C support long‑term performance in demanding environments.
• Compact footprint — Small L×D dimensions help reduce board area while providing substantial capacitance for decoupling and smoothing.
• Assembly‑friendly — Compatible with carrier‑tape feeding and automatic placement for high‑volume production runs.
• Documented electrical characteristics — Specified ripple currents, leakage current limits, and tan δ/impedance data enable predictable circuit design and validation.
• Regulatory compliance — RoHS conformity supports use in regulated markets and products.

Why Choose UWJ0J101MCL1GB?

UWJ0J101MCL1GB offers a balanced combination of compact size, automotive‑grade reliability, and assembly compatibility for designers needing 100 µF capacitance at a 6.3 V rail. Its AEC‑Q200 compliance and 2000‑hour load life at 85 °C make it suitable for demanding electronic modules where long‑term stability and predictable electrical behavior are required.

This part is a practical choice for engineers working on space‑constrained boards that require automated SMT placement and lead‑free reflow processing, delivering measurable electrical specifications such as ripple current ratings and defined leakage current limits to support confident system design.

Request a quote or submit an availability inquiry to receive pricing and lead‑time information for UWJ0J101MCL1GB. Our team can provide order details and support for integration into your production flow.