UWJ0J330MCL1GB

The UWJ0J330MCL1GB is a chip-type aluminum electrolytic capacitor designed for surface-mount applications. It delivers 33 µF capacitance at 6.3 V with polarized construction and is optimized for compact PCB layouts.

Engineered for durability in constrained environments, this part combines AEC-Q200-rated reliability, a 2000-hour endurance at 85°C, and compatibility with 260°C peak reflow assembly processes to support demanding embedded and automotive electronics designs.

Key Features

• Capacitance & Voltage — 33 µF nominal capacitance with a 6.3 V rated voltage and ±20% tolerance, suitable for decoupling and local energy storage in low-voltage systems.
• Package & Mounting — Chip-type, surface-mount aluminum can in φ5 × 5.4 mm size (L: 5.4 × D: 5 mm) with surface-mount land size 5.3 × 5.3 mm; supplied on embossed carrier tape for automated placement.
• Reflow Compatibility — Designed for 260°C peak reflow (recommended: 260°C peak 5 s; 230°C over 60 s, twice), and specified resistance to soldering heat (250°C for 30 s), enabling standard SMT assembly flows.
• Reliability & Qualification — AEC-Q200 rated and RoHS compliant; specified load life of 2000 hours at 85°C with defined endurance limits for capacitance, tan δ and leakage current.
• Electrical Performance — Low leakage current specification (≤ 3 µA), and defined ripple current handling of 37 mA at 120 Hz and 55.5 mA at 10 kHz for filtering and smoothing tasks.
• Temperature Range — Operates across −40°C to +85°C for use in a range of ambient conditions.

Typical Applications

• Automotive Electronics — Intended for automotive electronic modules that require AEC-Q200-rated capacitors for power decoupling and local energy buffering in control and infotainment systems.
• Power Supply Decoupling — Suited for decoupling and bulk smoothing on low-voltage power rails in embedded systems and board-level regulators.
• Sensor and ECU Modules — Compact footprint and robust endurance make it suitable for space-constrained sensor interfaces and ECU auxiliary circuits.

Unique Advantages

• AEC-Q200 Qualification: Provides component-level confidence for designs that reference automotive-grade reliability standards.
• SMT-Ready Chip Form Factor: Chip-type aluminum can and embossed carrier tape support automated pick-and-place workflows and high-density PCB assembly.
• High-Temperature Reflow Tolerance: Rated for 260°C peak reflow processes, allowing straightforward integration into modern SMT manufacturing lines.
• Long Endurance at Elevated Temperature: 2000 hours at 85°C endurance supports longevity in higher ambient or packaged environments.
• Measured Ripple and Low Leakage: Specified ripple current at both low and high frequencies plus low leakage current help maintain stable DC rails and reduce maintenance margins.

Why Choose UWJ0J330MCL1GB?

The UWJ0J330MCL1GB balances compact sizing with robust electrical and thermal endurance, making it a practical choice for designers needing a surface-mount aluminum electrolytic solution with automotive-grade reliability. Its combination of 33 µF capacitance, defined ripple handling, low leakage, and compatibility with 260°C reflow simplifies integration into automated manufacturing and power delivery networks.

This part is appropriate for embedded and automotive-oriented designs where AEC-Q200 qualification, defined lifetime at elevated temperature, and SMT assembly compatibility are important considerations.

If you would like pricing or availability information, please request a quote or submit an inquiry to receive a formal quote and further technical assistance.