UWJ1A101MCL1GB

The UWJ1A101MCL1GB is a chip-type aluminum electrolytic capacitor designed for surface-mount assembly on high-density PCBs. It delivers 100 µF capacitance at a 10 V rating in a compact SMD can-style package and is AEC‑Q200 compliant for automotive use.

Engineered for automated production and high-temperature solder processes, this part targets applications that require reliable board-level energy storage and filtering within an operating range of −40°C to +85°C.

Key Features

• Electrical Performance — 100 µF nominal capacitance with ±20% tolerance and a 10 V rated voltage; leakage current specified as ≤0.01CV or 3 µA (whichever is greater) after 2 minutes at 20°C.
• Ripple Handling — Low-frequency ripple current of 76 mA at 120 Hz and high-frequency ripple of 114 mA at 10 kHz for board-level smoothing and decoupling tasks.
• Package & Footprint — Chip (can‑style) SMD package sized L: 5.4 × D: 6.3 mm with recommended land pattern L: 6.6 × W: 6.6 mm for surface-mount placement.
• Assembly Compatibility — Designed for automatic mounting via carrier tape and compatible with 260°C peak reflow soldering (recommended: 260°C peak for 5 s; 230°C over 60 s, two passes).
• Thermal & Reliability — Rated for operation from −40°C to +85°C with a load life of 2000 hours at 85°C; endurance and stability test limits are defined in the product datasheet.
• Standards & Compliance — AEC‑Q200 compliant and RoHS (2011/65/EU, (EU)2015/863) compliant.

Typical Applications

• Automotive electronics — Suitable for automotive assemblies that require AEC‑Q200‑level components and board-level capacitors in surface-mount form.
• High-density PCB assemblies — Chip-type can package designed for placement on compact, densely routed boards using automated pick-and-place and tape-fed processes.
• Surface-mount power modules — Intended for use where localized capacitance and board-level energy buffering are required within a small SMD footprint.

Unique Advantages

• AEC‑Q200 compliance: Provides the qualification level required for many automotive electronic designs, supporting reliability expectations in vehicle systems.
• High-temperature reflow compatibility: Formulated to withstand 260°C peak reflow conditions, simplifying integration into standard SMT assembly flows.
• Compact, assembly-friendly form factor: Small L: 5.4 × D: 6.3 mm can-style SMD package and carrier-tape compatibility reduce PCB area and support automated production.
• Defined endurance at elevated temperature: 2000-hour load life at 85°C gives clear performance expectations for thermal stress and long-term use.
• Measured ripple specifications: Published ripple current figures at 120 Hz and 10 kHz help engineers evaluate performance in real-world power environments.

Why Choose UWJ1A101MCL1GB?

The UWJ1A101MCL1GB combines a compact SMD can package with automotive-grade qualification and defined thermal endurance, making it a practical choice for designs that demand reliable board-level capacitance in constrained spaces. Its compatibility with carrier-tape automated placement and 260°C peak reflow processes simplifies manufacturing integration.

This part is well suited to engineers specifying AEC‑Q200‑rated components for control modules and other assemblies where a 100 µF, 10 V polarized aluminum electrolytic is required. The published electrical and endurance specifications enable straightforward verification against system requirements and lifecycle expectations.

If you would like pricing, availability, or a formal quote for UWJ1A101MCL1GB, please submit a request or contact sales to discuss lead times and ordering options.