UWJ0J470MCL1GB

The UWJ0J470MCL1GB is a chip‑type aluminum electrolytic capacitor in a compact surface‑mount can designed for high‑density PCB assemblies. It delivers 47 µF at 6.3 V with a ±20% tolerance and is built to support AEC‑Q200 requirements for automotive and rugged electronics.

Engineered for automated assembly, this part supports high‑temperature reflow soldering and offers a combination of ripple handling, low leakage, and a proven endurance rating for demanding environments.

Key Features

• Capacitance and Voltage — 47 µF rated capacitance at 6.3 V with ±20% tolerance for bulk decoupling and energy storage in low‑voltage systems.
• Chip‑Type SMD Package — Radial, can‑style surface mount package sized Ø5 × 5.4 mm (L: 5.4 × D: 5 mm) for high‑density board layouts; supplied on embossed carrier taping for automated placement.
• High‑Temperature Reflow Compatibility — Compatible with 260°C peak reflow soldering (recommended peak 260°C for 5 s; 230°C over 60 s, 2 times) to suit modern assembly processes.
• Reliability and Lifetime — Rated load life of 2000 hours at 85°C; endurance characteristics return to specified limits after restoration to 20°C following life test.
• Electrical Performance — Dissipation factor (tan δ) 0.26 (max) at 20°C, 120 Hz; low leakage current specified at 3 µA (or 0.01CV, whichever is greater) after 2 minutes at rated voltage.
• Ripple Current Capability — 45 mA at 120 Hz (low frequency) and 67.5 mA at 10 kHz (high frequency) to support smoothing and decoupling in power rails.
• Operating Temperature Range — −40°C to +85°C to cover a wide range of embedded and automotive operating conditions.
• Compliance — RoHS directive compliant and AEC‑Q200 compliant for applications requiring automotive‑grade components.

Typical Applications

• Automotive Electronic Control Units (ECUs) — Bulk decoupling and smoothing for low‑voltage rails in control modules where AEC‑Q200 compliance is required.
• Power Management and DC/DC Converters — Output filter and energy storage to reduce voltage ripple and stabilize regulator outputs.
• Industrial and Embedded Systems — General decoupling and power‑rail stabilization in compact, surface‑mount designs operating across −40°C to +85°C.
• High‑Density PCB Assemblies — Small‑footprint SMD can capacitor for use where board area is constrained and automated placement is required.

Unique Advantages

• Automotive‑Grade Qualification: AEC‑Q200 compliance enables integration into designs that require automotive‑level component screening and traceability.
• Assembly‑Ready Packaging: Embossed carrier taping and chip‑type SMD form factor simplify automated pick‑and‑place assembly and reduce handling time.
• High‑Temperature Reflow Support: Rated for 260°C peak reflow processes, allowing seamless use with modern lead‑free assembly profiles.
• Proven Endurance: 2000 hours at 85°C life rating provides predictable long‑term behavior for power filtering and decoupling functions.
• Low Leakage and Controlled Losses: 3 µA leakage current spec and defined tan δ support stable performance in low‑voltage circuits.
• Compact Footprint: Ø5 × 5.4 mm package offers energy storage without a large board area impact, suitable for space‑constrained designs.

Why Choose UWJ0J470MCL1GB?

UWJ0J470MCL1GB combines a compact chip‑type SMD can with automotive‑grade qualification and reflow‑capable construction, providing a reliable solution for power decoupling and energy storage in demanding embedded and automotive environments. Its specified ripple currents, low leakage, and 2000‑hour endurance at 85°C give designers quantifiable performance for system reliability planning.

This capacitor is well suited to engineers and procurement teams building compact, assembly‑line friendly designs that need a predictable, qualified aluminum electrolytic solution for low‑voltage power rails.

Request a quote or submit an inquiry to sales to discuss current availability, pricing, and lead times for UWJ0J470MCL1GB.