UWJ1A470MCL1GB

The UWJ1A470MCL1GB is a chip-type aluminum electrolytic capacitor designed for surface-mount assembly. It provides 47 µF capacitance at 10 V with ±20% tolerance and is built for applications requiring AEC‑Q200 qualification and RoHS compliance.

Key value comes from its high-temperature reflow compatibility, compact radial can SMD package (φ6.3 × 5.4 mm), 2000-hour load life at 85°C, and low leakage and ripple characteristics that suit demanding automotive electronic assemblies.

Key Features

• Capacitance & Voltage — 47 µF nominal capacitance, rated at 10 V with ±20% tolerance for predictable energy storage and decoupling.
• Electrical Loss & Leakage — tan δ max 0.20 (120 Hz, 20°C) and leakage current specified at 4.7 µA, supporting stable performance in low-current and standby conditions.
• Ripple Current Performance — 52 mA at 120 Hz (low frequency) and 78 mA at 10 kHz (high frequency) for handling AC ripple on DC rails.
• Thermal & Lifetime — Rated operating range −40°C to +85°C with a rated load life of 2000 hours at 85°C.
• Assembly & Package — Chip-type radial can SMD (φ6.3 × 5.4 mm) supplied on embossed carrier tape for automated placement; recommended reflow: 260°C peak (5 s) and 230°C over 60 s (up to 2 cycles) per series guidance.
• Standards & Compliance — AEC‑Q200 compliant and RoHS compliant for automotive and regulated applications.

Typical Applications

• Automotive electronics — Intended for automotive modules requiring AEC‑Q200 qualification and RoHS compliance where a 47 µF, 10 V SMD electrolytic capacitor is needed.
• Power supply smoothing — Used on PCB power rails to provide bulk capacitance and ripple handling consistent with the listed ripple current ratings and leakage performance.
• Compact SMD assemblies — Suited to high-density boards where a small radial can SMD (φ6.3 × 5.4 mm) and embossed carrier taping support automated assembly.

Unique Advantages

• AEC‑Q200 qualification: Confirms suitability for automotive electronic applications that specify AEC‑Q200 compliance.
• High-temperature reflow compatibility: Supports 260°C peak reflow conditions, enabling reliable surface-mount assembly processes.
• Compact SMD footprint: φ6.3 × 5.4 mm chip package and 6.6 × 6.6 mm recommended land pattern preserve PCB space while providing 47 µF capacitance.
• Long load life at elevated temperature: 2000 hours at 85°C offers endurance for designs exposed to sustained thermal stress.
• Low leakage and controlled loss: 4.7 µA leakage and tan δ 0.20 (10 V) support energy-efficient operation and predictable impedance at 120 Hz.
• Automated assembly ready: Embossed carrier taping and chip-type construction facilitate pick-and-place processes.

Why Choose UWJ1A470MCL1GB?

The UWJ1A470MCL1GB combines AEC‑Q200 compliance, RoHS conformance, and reflow-capable chip construction in a compact SMD radial-can package. Its specified ripple current capability, low leakage, and 2000-hour life at 85°C make it a practical choice for automotive electronic assemblies and other applications that require automotive-grade components and reliable board-level performance.

Choose this part for maintenance and replacement in qualifying designs where the documented electrical, thermal, and assembly characteristics match system requirements. Note: this product is identified as End of Life; verify suitability for new designs before selection.

For pricing, availability, or to request a quote for UWJ1A470MCL1GB, submit an inquiry to our sales team with your quantity and delivery requirements.