UWJ1C220MCL1GB

The UWJ1C220MCL1GB from Nichicon is a chip-type aluminum electrolytic capacitor engineered for surface-mount applications. It delivers 22 µF capacitance at a 16 V rating with ±20% tolerance and is optimized for high-density PCB assembly and automated mounting.

Key value comes from robust endurance and assembly compatibility: AEC-Q200 qualification for demanding environments, RoHS compliance, 2000 hours load life at 85°C, and compatibility with high-temperature reflow processing for reliable solder joints.

Key Features

• Core Type  Aluminum electrolytic, chip-style construction providing 22 µF capacitance at 16 V with ±20% tolerance for general power filtering and decoupling.
• Electrical Performance  Low dissipation factor with tanδ = 0.16 (120 Hz, 20°C), leakage current of 3.52 µA, and specified ripple current of 37 mA at 120 Hz and 55.5 mA at 10 kHz to support steady-state and higher-frequency ripple conditions.
• Reliability & Endurance  Rated for 2000 hours of load life at 85°C; endurance characteristics include capacitance retention within ±20% and controlled tanδ and leakage after endurance testing.
• Temperature Range  Designed to operate across –40°C to 85°C, matching common electronics operating environments.
• Package & Mounting  Chip-type radial can SMD in a compact φ5 × 5.4L footprint with embossed carrier taping for automatic pick-and-place assembly on high-density PCBs.
• Assembly Compatibility  Specified for reflow processing (compatible with 260°C peak reflow recommendations) and soldering-heat resistance per datasheet conditions for reliable manufacturing.
• Standards & Compliance  AEC-Q200 rated and RoHS compliant for regulated and qualification-driven applications.

Typical Applications

• Automotive electronic systems  Suitable for use in automotive modules where AEC-Q200 qualification is required and compact surface-mount capacitors are needed.
• High-density PCB designs  Designed for surface mounting on high-density boards and compatible with automated carrier-tape assembly.
• Power filtering and decoupling  Provides capacitance and ripple handling for local supply stabilization on board-level power rails.

Unique Advantages

• AEC-Q200 qualification:  Specifies suitability for applications that require established automotive-grade component qualification and reliability.
• High-temperature reflow compatibility:  Supports modern reflow profiles (260°C peak), enabling robust solder joints during standard SMT assembly processes.
• Compact SMD package with tape feed:  Chip-type, embossed carrier taping facilitates automated placement on dense PCBs and streamlines manufacturing.
• Measured ripple and leakage specs:  Provided low-frequency and high-frequency ripple current ratings plus a quantified leakage current value for predictable power-supply behavior.
• Proven endurance:  2000 hours at 85°C life rating with defined limits on capacitance change, tanδ, and leakage current to support long-term reliability assessments.

Why Choose UWJ1C220MCL1GB?

UWJ1C220MCL1GB is positioned for engineers seeking a compact, qualified aluminum electrolytic solution for surface-mount power conditioning on high-density boards. Its combination of AEC-Q200 rating, RoHS compliance, specified ripple performance, and endurance at elevated temperature makes it suitable for qualification-driven designs that require predictable behavior and automated assembly compatibility.

This part is a practical choice for designers balancing size, verified endurance, and reflow-compatible assembly processes where an established electrolytic capacitor form factor is required.

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