UWJ1E100MCL1GB

The UWJ1E100MCL1GB is a chip-type aluminum electrolytic capacitor in a compact surface-mount can, specified at 10 µF and 25 V. It is designed for surface-mount assembly on high-density PC boards and is compatible with automated carrier-tape mounting.

Engineered for application environments that require AEC-Q200 compliance, 2000 hours of load life at 85°C and RoHS conformity, this part offers a combination of compact packaging, reflow robustness and long-term endurance for automotive and industrial SMD designs.

Key Features

• Package & Mounting — Chip-type radial can in an SMD package sized L: 5.4 × D: 5.0 mm with a surface-mount land footprint of 5.3 × 5.3 mm for high-density PCB layouts.
• Rated Electrical — 10 µF capacitance at a 25 V rated voltage with ±20% tolerance.
• Thermal & Endurance — Specified operating range of −40°C to +85°C with a rated load life of 2000 hours at 85°C.
• Reflow Compatibility — Designed to correspond with 260°C peak reflow soldering (recommended: 260°C peak for 5 s; 230°C over 60 s, up to two cycles) and specified resistance to soldering heat.
• Ripple Current Ratings — Low-frequency ripple current of 27 mA at 120 Hz and high-frequency ripple current of 40.5 mA at 10 kHz.
• Automotive Qualification & Compliance — AEC-Q200 rated and RoHS compliant for regulated environmental requirements.

Typical Applications

• Automotive Electronics — For AEC-Q200-qualified automotive modules that require a compact 10 µF, 25 V polarized SMD capacitor with defined load-life performance at 85°C.
• High-density SMD Assemblies — Fits tight board layouts where a small chip-type aluminum electrolytic capacitor is needed and automated placement is used.
• Industrial Embedded Modules — Use in surface-mount systems that require RoHS compliance and long-term endurance under elevated temperature conditions.

Unique Advantages

• AEC-Q200 qualification: Enables use in designs that require automotive-grade component-level reliability.
• Reflow-process capable: Supports 260°C peak reflow soldering to integrate with standard SMD assembly flows and automated placement.
• Compact footprint: 5.4 × 5.0 mm package and SMD land of 5.3 × 5.3 mm minimize PCB area for dense board designs.
• Defined endurance: 2000 hours at 85°C with specified limits for capacitance change, tan δ and leakage current, providing predictable lifetime behavior.
• Regulatory compliance: RoHS conformity for restricted substance requirements in modern electronics manufacturing.

Why Choose UWJ1E100MCL1GB?

UWJ1E100MCL1GB combines small-package SMD convenience with automotive-grade qualifications and defined endurance characteristics. Its 10 µF, 25 V rating, reflow compatibility and AEC-Q200 compliance make it suitable for engineers specifying reliable polarized capacitance in tightly packed, automated assembly environments.

This part is well suited to design teams seeking a compact electrolytic solution with documented thermal and life performance, especially for applications requiring RoHS compliance and AEC-Q200-level reliability. The clear specifications for ripple current, operating temperature and load life simplify integration and lifetime planning.

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