UWJ1E4R7MCL1GB

The UWJ1E4R7MCL1GB is a surface-mount aluminum electrolytic capacitor from Nichicon's UWJ series. It provides a nominal capacitance of 4.7 µF at a rated voltage of 25 V in a compact φ4 × 5.4 mm chip package designed for automated SMT assembly.

Engineered for applications requiring AEC‑Q200 qualification and RoHS compliance, the part is specified for operation from −40°C to +85°C and offers a rated load life of 2000 hours at 85°C, with reflow compatibility to a 260°C peak.

Key Features

• Capacitance & Voltage — 4.7 µF nominal capacitance with a rated voltage of 25 V and tolerance −20% to +20%.
• Package & Mounting — Surface-mount chip (radial can SMD) in a φ4 × 5.4 mm body; surface-mount land size 4.3 × 4.3 mm and supplied in embossed carrier taping for automated placement.
• Temperature Range & Endurance — Operating temperature −40°C to +85°C and load life of 2000 hours at 85°C.
• Reliability & Compliance — AEC‑Q200 compliant and RoHS compliant.
• Electrical Characteristics — Loss tangent (tanδ) 0.14 measured at 20°C, 120 Hz; leakage current specified at 3 µA; low-frequency ripple current 16 mA (120 Hz) and high-frequency ripple current 24 mA (10 kHz).
• Reflow Compatibility — Corresponds with 260°C peak reflow soldering; recommended reflow condition: 260°C peak for 5 s, 230°C for over 60 s (two passes) as specified in the UWJ series documentation.

Typical Applications

• Automotive Electronics — Suitable for automotive modules and assemblies where AEC‑Q200 qualification and RoHS compliance are required.
• High‑density SMD Assemblies — Chip-type radial can package and compact footprint fit densely populated printed circuit boards.
• Automated PCB Production — Supplied in embossed carrier taping and designed for automatic mounting machines to streamline high-volume assembly.

Unique Advantages

• AEC‑Q200 Qualified Component: Meets AEC‑Q200 requirements, providing a verifiable qualification path for demanding applications.
• Compact, SMT‑Ready Form Factor: φ4 × 5.4 mm chip package reduces board area while supporting surface-mount processes.
• Defined Electrical Behavior: Low leakage current (3 µA) and a specified tanδ (0.14 at 20°C, 120 Hz) enable predictable performance in designs that track loss and leakage.
• Production‑oriented Packaging: Embossed carrier taping and chip-type construction facilitate automated pick-and-place handling.
• Heat‑resistant Reflow Profile: Compatible with a 260°C peak reflow process to align with common SMT assembly requirements.
• Endurance at Elevated Temperature: Rated life of 2000 hours at 85°C supports prolonged operation in higher-temperature environments.

Why Choose UWJ1E4R7MCL1GB?

The UWJ1E4R7MCL1GB combines compact SMD packaging, defined electrical characteristics, and industry-directed qualification to address designs that require a small, surface-mount aluminum electrolytic capacitor with verifiable endurance. Its AEC‑Q200 compliance and RoHS status make it a suitable choice where qualification and regulatory conformity are part of the design criteria.

Note: This product is scheduled as End Of Life and is not recommended for new designs.

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