UWJ1E220MCL1GB

The UWJ1E220MCL1GB is a chip-type aluminum electrolytic capacitor specified at 22 µF and 25 V, designed for surface mounting on high-density printed circuit boards. It supports high-temperature reflow processes (260°C peak) and is compatible with automatic mounting machines fed with carrier tape, making it suited to automated SMD assembly workflows.

This part is AEC-Q200 compliant and RoHS (2011/65/EU, (EU)2015/863) compliant, with a rated operating range of −40°C to +85°C and a load life of 2000 hours at 85°C. Note: this product is scheduled to be discontinued and is not recommended for new designs.

Key Features

• Capacitance & Voltage — 22 µF nominal capacitance with a 25 V rated voltage; tolerance ±20% at 120 Hz, 20°C.
• High-temperature Reflow Compatibility — Designed to correspond with 260°C peak reflow soldering; recommended reflow condition: 260°C peak for 5 seconds and 230°C for over 60 seconds (2 times).
• Chip Form Factor & Mounting — 5.5 mm chip-type height for surface-mount placement on high-density PC boards; applicable to automatic mounting machines using carrier tape.
• Reliability & Endurance — Load life specified as 2000 hours at 85°C; endurance requirements met after restoration to 20°C following the life test.
• Temperature Range — Rated for operation from −40°C to +85°C.
• Ripple Current — 42 mA at 120 Hz (low frequency) and 63 mA at 100 kHz (high frequency).
• Standards & Compliance — AEC-Q200 compliant and RoHS directive compliant (2011/65/EU, (EU)2015/863).
• Dimensions & Land Pattern — Component size L: 5.4 × D: 6.3 mm; recommended surface mount land size L: 6.6 × W: 6.6 mm.
• Polarization & Leakage — Polarized capacitor; leakage current specification: not more than 0.01CV or 3 µA (whichever is greater) after 2 minutes at 20°C when rated voltage is applied.

Typical Applications

• Automotive electronics — Suitable for use in automotive systems where AEC-Q200 compliance is required and an SMD aluminum electrolytic capacitor is specified.
• High-density SMD assemblies — Chip form factor and compact dimensions make this capacitor appropriate for tightly packed printed circuit boards.
• Automated production lines — Designed for compatibility with carrier-tape fed automatic mounting equipment and high-temperature reflow processes.

Unique Advantages

• 260°C reflow-ready: Enables lead-free, high-temperature solder processes with specified reflow profile guidance.
• AEC-Q200 compliance: Provides an industry-recognized qualification level for applications that require automotive-grade component standards.
• Compact, chip-type package: 5.5 mm chip height and small footprint support space-constrained board designs.
• Proven endurance at elevated temperature: 2000 hours load life at 85°C for sustained performance in thermal environments within the specified range.
• Assembly-friendly: Compatible with tape-fed automated placement and standard surface-mount land patterns for efficient manufacturing integration.
• Regulatory compliance: RoHS compliant to support regulatory and environmental requirements.

Why Choose UWJ1E220MCL1GB?

UWJ1E220MCL1GB offers a compact, surface-mount aluminum electrolytic solution for designs requiring 22 µF at 25 V with high-temperature reflow compatibility. Its chip form factor, tape-feed compatibility, and specified land pattern make it straightforward to integrate into automated SMD assembly processes on high-density PCBs.

The part’s AEC-Q200 and RoHS compliance, along with a defined load life of 2000 hours at 85°C and specified ripple current characteristics, make it suitable for applications that require traceable specifications and controlled end-of-life performance. Please note that this product is scheduled for discontinuation and is not recommended for new designs; check availability before planning usage.

For availability, lead times, or to request a quote for UWJ1E220MCL1GB, contact sales to submit your quantity and delivery requirements.