UWJ1H100MCL1GB

The UWJ1H100MCL1GB is a chip-type aluminum electrolytic capacitor designed for surface-mount assembly on high-density PCBs. It provides 10 µF capacitance at 50 V with ±20% tolerance and is built for applications requiring AEC-Q200 qualification and RoHS compliance.

Engineered for automated production, this embossed carrier–taped SMD capacitor supports high-temperature reflow (260°C peak) and offers a 2000-hour load life at 85°C for reliable performance in demanding environments. Note: this product/series is scheduled for discontinuation and is not recommended for new designs.

Key Features

• Capacitance and Voltage: 10 µF nominal capacitance with a 50 V rated voltage and ±20% tolerance, suitable for applications that require moderate energy storage in a compact SMD package.
• Package and Mounting: Chip-type surface-mount aluminum can (φ6.3 × 5.4 mm body, land: 6.6 × 6.6 mm) supplied on embossed carrier tape for automated placement.
• High-temperature Reflow Compatibility: Designed to withstand 260°C peak reflow soldering, with recommended reflow conditions defined for robust solder process integration.
• Reliability and Endurance: Rated lifetime of 2000 hours at 85°C with specified endurance limits (capacitance change within ±20%, leakage and tan δ within datasheet limits) to support sustained operation.
• Performance Metrics: Low-frequency ripple current of 33 mA at 120 Hz and high-frequency ripple current of 49.5 mA at 10 kHz; leakage current specified at 5 µA.
• Environmental and Qualification: RoHS compliant and AEC-Q200 rated, meeting industry requirements for controlled materials and automotive-grade qualification.

Typical Applications

• Automotive Electronics: Suitable for use in automotive electronic modules where AEC-Q200 qualification and high-temperature reflow compatibility are required.
• Surface-Mount Power Assemblies: Used in compact SMD power and filtering circuits that need an electrolytic capacitor with defined ripple-current and leakage characteristics.
• High-density PCB Designs: Designed for automated placement on densely populated boards thanks to its chip-type can and embossed carrier tape packaging.

Unique Advantages

• Automotive-grade Qualification: AEC-Q200 rating provides confidence for deployment in applications that demand industry-recognized reliability standards.
• High-temperature Process Compatibility: Compatibility with 260°C peak reflow simplifies integration into modern SMT production flows without special handling.
• Compact SMD Footprint: Small φ6.3 × 5.4 mm can with a 6.6 × 6.6 mm recommended land pattern reduces board area compared with larger radial alternatives.
• Robust Endurance: 2000-hour load life at 85°C ensures sustained capacitance and leakage performance in elevated-temperature environments.
• Traceable Environmental Compliance: RoHS compliance supports regulatory requirements for material content and environmental considerations.

Why Choose UWJ1H100MCL1GB?

The UWJ1H100MCL1GB combines automotive-grade qualification, high-temperature reflow compatibility, and a compact SMD form factor to meet the needs of space-constrained, reliability-focused electronic designs. Its defined ripple current, low leakage, and 2000-hour endurance at 85°C make it appropriate for assemblies requiring stable performance under thermal and electrical stress.

This part is positioned for engineers and procurement teams looking for a RoHS-compliant, AEC-Q200-rated aluminum electrolytic chip capacitor that integrates into automated SMT lines. Keep in mind the product/series is scheduled for discontinuation and is not recommended for new designs.

To request pricing, lead time, or a formal quote for UWJ1H100MCL1GB, please submit a quote request to the supplier or sales channel for availability and ordering details.