UWJ1H4R7MCL1GB

The UWJ1H4R7MCL1GB is a surface-mount aluminum electrolytic chip capacitor in Nichicon’s UWJ series, offering 4.7 µF capacitance at 50 V with ±20% tolerance. It is designed for high-density PCB assembly as a chip-type SMD can with embossed carrier taping and compatibility with automated placement.

Key performance attributes include AEC-Q200 rating, a -40°C to 85°C operating range, low leakage current and controlled dissipation factor; the part carries a 2000-hour endurance rating at 85°C. Note: this product is scheduled for discontinuation and is not recommended for new designs.

Key Features

• Capacitance & Voltage — 4.7 µF nominal capacitance at a 50 V rated voltage with ±20% tolerance suitable for applications requiring moderate bulk capacitance on 50 V rails.
• High-temperature reflow compatibility — Engineered for 260°C peak reflow soldering (recommended peak 260°C for 5 s; 230°C over 60 s, 2 times), supporting modern SMT assembly processes.
• Automotive-grade reliability — AEC-Q200 listed rating and a 2000-hour load life at 85°C provide quantifiable endurance for demanding environments.
• Electrical performance — Low leakage current (max 3 µA), tan δ 0.12 (max) at 20°C/120 Hz, and specified ripple currents (20 mA at 120 Hz, 30 mA at 10 kHz) for predictable behavior under AC stress.
• Compact SMD package — Chip-can format with dimensions Ø5 × 5.4 mm (L: 5.4 × D: 5 mm) and surface-mount land size 5.3 × 5.3 mm for space-constrained PCB layouts.
• Assembly-ready packaging — Embossed carrier taping enables automatic mounting machine compatibility to streamline high-volume production.

Typical Applications

• Automotive electronics — AEC-Q200 listing, -40°C to 85°C range, and 2000 h endurance at 85°C make this capacitor suitable for use in automotive electronic modules requiring surface-mount bulk capacitance.
• Surface-mount high-density PCBs — Chip-can SMD form and embossed carrier taping support automated placement on compact, densely populated boards.
• Power rail decoupling and smoothing — 4.7 µF at 50 V with low leakage and specified ripple currents provides local capacitance for stabilizing DC rails in electronic systems.

Unique Advantages

• 260°C reflow tolerance: Supports modern SMT assembly flows with specified reflow profile guidance for reliable soldering.
• AEC-Q200 listed: Offers an established reliability baseline for designers targeting regulated automotive electronic applications.
• Measurable endurance: 2000-hour load life at 85°C provides defined lifetime behavior for thermal and electrical stress planning.
• Low leakage and controlled dissipation: Leakage current limited to 3 µA and tan δ specified at 120 Hz help maintain predictable circuit performance.
• Assembly-friendly packaging: Embossed carrier taping and chip-type SMD format reduce handling complexity and support automated board assembly.

Why Choose UWJ1H4R7MCL1GB?

The UWJ1H4R7MCL1GB positions itself as a compact, assembly-ready SMD aluminum electrolytic solution for designers who require a 4.7 µF, 50 V capacitor with defined endurance and AEC-Q200-level reliability. Its combination of 260°C reflow compatibility, low leakage, specified dissipation factor and ripple current ratings enables predictable performance on high-density PCBs and automotive electronic modules.

This part is suited to teams needing a quantifiable endurance profile and automated assembly support. Availability considerations apply, as the product is scheduled for discontinuation and is not recommended for new designs.

If you would like pricing, availability, or lead-time information for UWJ1H4R7MCL1GB, request a quote or contact sales to discuss your requirements and current stock.