UWJ1H3R3MCL1GB

The UWJ1H3R3MCL1GB is a chip-type aluminum electrolytic capacitor designed for surface-mount applications. It delivers 3.3 µF capacitance at 50 V in a compact φ4 × 5.4 mm SMD can, optimized for high-density PC boards and automated assembly.

Key value propositions include AEC-Q200 compliance for demanding environments, compatibility with 260°C peak reflow soldering, and predictable electrical behavior through specified leakage, tan δ and ripple current ratings. The part is available in embossed carrier tape for automatic placement.

Key Features

• Electrical Performance 3.3 µF capacitance with ±20% tolerance at 120 Hz; rated voltage 50 V. Maximum tan δ is 0.12 (120 Hz, 20°C) and specified leakage current is 3 µA.
• Ripple Current Low frequency ripple current: 17 mA at 120 Hz; high frequency ripple current: 25.5 mA at 10 kHz, providing defined AC handling characteristics for design verification.
• Package & Assembly Chip-type radial can SMD (φ4 × 5.4 mm; L: 5.4 × D: 4 mm) with recommended PCB land size 4.3 × 4.3 mm. Supplied on embossed carrier tape and compatible with automatic mounting machines.
• Reflow Compatibility Designed to correspond with 260°C peak reflow soldering. Recommended reflow condition: 260°C peak for 5 seconds (and 230°C over 60 seconds, 2 times as per datasheet guidance).
• Reliability & Endurance Load life: 2000 hours at 85°C with specified limits for capacitance change, tan δ and leakage current. Rated operating temperature range is −40°C to +85°C.
• Compliance AEC-Q200 compliant and RoHS directive compliant (2011/65/EU, (EU)2015/863).
• Product Status This product is scheduled for discontinuation and is not recommended for new designs.

Typical Applications

• Automotive electronics — AEC-Q200 compliance makes this capacitor suitable where automotive-grade passive components are specified.
• High-density surface-mount PCBs — Chip-type SMD can enables compact placement on densely populated boards.
• Automated assembly — Embossed carrier tape and compatibility with automatic mounting machines support pick-and-place production flows.

Unique Advantages

• Compact SMD form factor: φ4 × 5.4 mm chip-type package fits tight layouts on high-density PCBs while providing aluminum electrolytic capacitance.
• Defined electrical characteristics: Specified tan δ (0.12), leakage current (3 µA) and ripple currents (17 mA @120 Hz / 25.5 mA @10 kHz) deliver predictable performance for validation and BOM selection.
• Reflow-capable for lead-free processes: Rated for 260°C peak reflow per the manufacturer’s recommended profile to support modern SMT assembly.
• AEC-Q200 compliance: Conforms to AEC-Q200 requirements for passive components, supporting use in designs that require that qualification.
• Long-duration endurance data: 2000-hour load life at 85°C provides a defined baseline for high-temperature operating life assessments.
• SMD-friendly packaging: Embossed carrier taping and package dimensions aligned to automated placement processes reduce handling and assembly complexity.

Why Choose UWJ1H3R3MCL1GB?

This UWJ-series chip-type aluminum electrolytic capacitor combines compact SMD packaging with defined electrical and environmental performance—3.3 µF at 50 V, low leakage and specified ripple currents—making it suitable for space-constrained, automated production environments where predictable capacitor behavior and reflow compatibility are required.

With AEC-Q200 compliance and a documented 2000-hour load life at 85°C, the part provides traceable endurance data for demanding applications. Note that this product is scheduled for discontinuation and is not recommended for new designs; please verify current availability and support options if considering it for existing designs.

If you would like pricing, current availability or a formal quote for UWJ1H3R3MCL1GB, request a quote or contact sales to discuss lead times and order quantities.