UWJ1E330MCL1GB

The UWJ1E330MCL1GB is a surface-mount aluminum electrolytic chip capacitor in Nichicon’s UWJ series. It delivers 33 µF capacitance at a 25 V rating in a compact radial can SMD package sized 5.4 mm × 6.3 mm with a seated height of 5.4 mm.

Designed for demanding electronic assemblies, this part combines AEC-Q200 compliance, RoHS conformance and high-temperature reflow capability (260°C peak) with a rated operating range of −40°C to +85°C and a load life of 2000 hours at 85°C.

Key Features

• Capacitance & Voltage — 33 µF nominal capacitance with a 25 V rated voltage and ±20% tolerance for standard power decoupling and bulk capacitance needs.
• Package & Mounting — Chip-type radial can SMD package sized L: 5.4 × D: 6.3 mm with surface-mount land recommendation of 6.6 × 6.6 mm; compatible with automatic mounting tape feeders.
• High-temperature Reflow Compatibility — Engineered to withstand 260°C peak reflow soldering; recommended reflow condition: 260°C peak for 5 seconds, and 230°C for over 60 seconds, repeatable up to two cycles as specified.
• Automotive-grade Reliability — AEC-Q200 compliant and specified for a load life of 2000 hours at 85°C; operating temperature range −40°C to +85°C.
• Electrical Performance — Specified ripple current: 52 mA at 120 Hz and 78 mA at 10 kHz; leakage current limits and tan δ characteristics per the UWJ series specifications.
• Compliance — RoHS compliant, meeting the referenced directive requirements for restricted substances.

Typical Applications

• Automotive electronic modules — Suited for vehicle electronics that require AEC-Q200 compliance, a 25 V capacitor value and SMD packaging for automated assembly.
• Power rail decoupling — Compact 33 µF, 25 V device for local energy storage and decoupling on densely populated PCBs.
• High-density surface-mount assemblies — Chip-type can package and carrier-tape compatibility for automated placement in space-constrained designs.

Unique Advantages

• Automotive-capable construction — AEC-Q200 compliance and a specified −40°C to +85°C operating range support use in automotive-grade electronic assemblies.
• Reflow-ready for modern assembly — Rated for 260°C peak reflow temperatures with recommended profile guidance to simplify SMT soldering processes.
• Compact SMD form factor — Small footprint (5.4 × 6.3 mm) and defined land pattern (6.6 × 6.6 mm) reduce PCB area while remaining compatible with automated placement.
• Proven endurance — Load-life specification of 2000 hours at 85°C provides a clear, testable endurance baseline for design validation.
• Measured ripple performance — Published ripple current values at 120 Hz and 10 kHz allow designers to assess suitability for specific power-frequency conditions.
• Regulatory compliance — RoHS conformance supports designs targeting restricted-substance requirements.

Why Choose UWJ1E330MCL1GB?

UWJ1E330MCL1GB combines a compact SMD aluminum electrolytic form with automotive-grade qualifications and high-temperature reflow capability, making it well suited for engineers specifying robust, assembly-friendly capacitors for automotive and industrial electronics. The part’s documented load life, ripple current ratings and defined land pattern simplify integration and reliability verification.

This capacitor is appropriate for teams that require clear, verifiable specifications for endurance, reflow processing and environmental compliance while maintaining a small PCB footprint and automated assembly compatibility.

Request a quote or contact sales to check current availability, lead times and obtain pricing for UWJ1E330MCL1GB. Note: this product is listed as End of Life; please confirm stock and sourcing options with sales.