UWJ1C330MCL1GB

The UWJ1C330MCL1GB is a chip‑type aluminum electrolytic capacitor in a compact SMD can designed for surface mounting on high‑density PC boards. It delivers 33 µF capacitance at a 16 V rating with AEC‑Q200 compliance and RoHS conformity, making it suited to demanding automotive and industrial electronics that require reliable power decoupling and smoothing.

Engineered for automated assembly, the device supports embossed carrier taping and is specified for 260 °C peak reflow profiles, enabling integration into modern Pb‑free SMT production flows.

Key Features

• Capacitance & Voltage — 33 µF nominal capacitance with a 16 V rated voltage and ±20% tolerance for predictable bulk energy storage and decoupling.
• Package & Mounting — Chip‑type aluminum can in a φ6.3 × 5.4 mm (L × D) SMD package with surface‑mount land size 6.6 × 6.6 mm, compatible with automated placement via embossed carrier tape.
• Reflow Compatibility — Rated for 260 °C peak reflow soldering (recommended 260 °C peak for 5 s or 230 °C over 60 s, up to two passes), enabling lead‑free assembly on modern production lines.
• Thermal & Lifetime — Operating temperature range −40 °C to +85 °C with a rated load life of 2000 hours at 85 °C for predictable long‑term performance under elevated temperature stress.
• Electrical Loss & Leakage — Low dissipation factor (tan δ) of 0.16 at 20 °C and 120 Hz, and a measured leakage current of 5.28 µA, supporting efficient filtering and low standby loss.
• Ripple Handling — Specified ripple current of 49 mA at 120 Hz and 73.5 mA at 10 kHz to support AC ripple filtering in power rails.
• Quality & Compliance — AEC‑Q200 compliant and RoHS compliant to meet industry quality and environmental requirements for automotive and industrial applications.

Typical Applications

• Automotive Electronics — Bulk decoupling and smoothing in automotive control modules where AEC‑Q200 qualification and a 16 V rating are required.
• High‑Density Surface‑Mount Assemblies — Power filtering on compact PCBs that benefit from chip‑type aluminum can packaging and embossed carrier taping for automated placement.
• Power Supply Filtering — Input/output smoothing and local energy storage on DC power rails with defined ripple current and low dissipation factor.

Unique Advantages

• Automotive‑grade reliability: AEC‑Q200 compliance and a 2000‑hour life at 85 °C provide design confidence in temperature‑stressed environments.
• Production‑friendly reflow: 260 °C peak reflow compatibility supports lead‑free assembly processes and multi‑pass soldering requirements.
• Compact SMD can: φ6.3 × 5.4 mm package offers high capacitance in a small board footprint for space‑constrained designs.
• Low loss and low leakage: 0.16 tan δ and 5.28 µA leakage current support efficient filtering with minimal standby drain.
• Automated assembly ready: Embossed carrier taping and SMD can construction simplify integration into pick‑and‑place lines and high‑volume manufacturing.

Why Choose UWJ1C330MCL1GB?

UWJ1C330MCL1GB combines a compact chip‑type aluminum electrolytic package with automotive‑grade qualification and production‑ready reflow capability, delivering a balance of capacitance, reliability, and manufacturability. Its electrical characteristics—33 µF at 16 V, low tan δ, defined ripple current ratings, and low leakage—make it appropriate for power filtering and decoupling tasks in automotive and industrial systems.

This capacitor is ideal for designers specifying AEC‑Q200 compliant components for tight board layouts and automated assembly processes who need stable performance across −40 °C to +85 °C and long‑term endurance under load.

Request a quote or contact sales for pricing, lead times, and availability for UWJ1C330MCL1GB.