UWJ1A330MCL1GB

CAP ALUM 33UF ±20% 10V SMD
Part Description

33 µF 10 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 1,746 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUWJ
ManufacturerNichicon
Manufacturing StatusEnd Of Life
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotiveCapacitance33 µFECCNEAR99
ESRN/AHeight Seated (Max)5.5 mmHTS Code8532.22.0020
ImpedanceN/ALead SpacingN/ALifetime @ Temp2000 h @ 85°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-40°C - 85°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency61.5 mA @ 10 kHzRipple Current Low Frequency41 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension5.4 x 5 mmSurface Mount Land Size5.3 x 5.3 mm
Tolerance-20%~20%Voltage10 V

Overview of UWJ1A330MCL1GB – Aluminum Electrolytic Chip Capacitor, 33 µF, 10 V

The UWJ1A330MCL1GB is a surface-mount aluminum electrolytic chip capacitor in the Nichicon UWJ series designed for high-temperature reflow processing and automated assembly. It delivers 33 µF capacitance at 10 V with a compact φ5 × 5.4 mm can-style SMD package, intended for high-density PC board mounting and machine placement.

Key value propositions include AEC-Q200 compliance for automotive applications, a rated lifetime of 2000 hours at 85°C, low leakage current and specified ripple current performance—making it suitable where AEC-qualified SMD electrolytic capacitors are required. Note: the UWJ series datasheet indicates the series is scheduled to be discontinued and not recommended for new designs.

Key Features

  • Capacitance & Voltage — 33 µF rated capacitance at 10 V with ±20% tolerance to support DC decoupling and energy storage in compact SMD designs.
  • Package & Mounting — Chip-type radial can SMD in a φ5 × 5.4 mm package (surface-mount); supplied in embossed carrier taping compatible with automatic mounting machines.
  • Reflow Compatibility — Designed to withstand 260°C peak reflow (recommended: 260°C peak for 5 s; 230°C over 60 s, up to 2 cycles) for modern assembly processes.
  • Reliability & Endurance — Load life of 2000 hours at 85°C with specified endurance limits: capacitance change within ±20%, tan δ up to 200% of initial spec, and leakage current not exceeding initial specified value after test.
  • Temperature Range — Rated for operation from −40°C to +85°C to match common electronic system environments.
  • Electrical Performance — Low-frequency ripple current of 41 mA at 120 Hz and high-frequency ripple current of 61.5 mA at 10 kHz; leakage current specified at 3.3 µA.
  • Compliance — RoHS compliant and AEC-Q200 compliant for designs requiring automotive-grade component qualification.

Typical Applications

  • Automotive Electronics — For use in automotive electronic modules where AEC-Q200 qualification and SMD packaging are required for assembly and performance.
  • High‑Density PCB Assemblies — Suited to compact surface-mount boards that require machine-placed electrolytic capacitors supplied on embossed carrier tape.
  • Production Lines with Reflow Soldering — Intended for assemblies using high-temperature reflow profiles (260°C peak) and automatic placement equipment.

Unique Advantages

  • AEC-Q200 Qualification: Provides the documented qualification needed for automotive and similarly demanding electronic applications.
  • High‑Temperature Reflow Tolerance: Supports 260°C peak reflow profiles, enabling use in modern SMD assembly processes without manual soldering steps.
  • Compact SMD Can Package: φ5 × 5.4 mm chip-type can provides a small footprint for high-density designs while retaining electrolytic capacitance values.
  • Long Endurance at Elevated Temperature: 2000 hours at 85°C rated life supports sustained operation in elevated-temperature environments.
  • Measured Ripple and Low Leakage: Specified ripple currents at 120 Hz and 10 kHz plus low leakage current (3.3 µA) enable predictable performance in power-filtering roles.
  • Automated Assembly Ready: Embossed carrier taping and chip-type SMD format facilitate efficient pick-and-place production flow.

Why Choose UWJ1A330MCL1GB?

UWJ1A330MCL1GB combines AEC-Q200 qualification, a compact chip-style SMD package, and defined reflow compatibility to meet the needs of automotive and industrial assemblies that require automotive-grade electrolytic capacitance in surface-mount form. Its specified endurance (2000 hours at 85°C), low leakage, and ripple current ratings provide predictable electrical behavior for engineered designs.

This part is suited for engineers and procurement teams sourcing AEC-qualified SMD electrolytic capacitors for existing production processes that use high-temperature reflow and automated placement. The combination of compliance, packaged form, and documented specifications supports reliable integration into controlled manufacturing environments.

To request a quote or check availability for UWJ1A330MCL1GB, please contact sales or submit a quote request with your quantity and delivery requirements.

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