UWJ1A330MCL1GB
| Part Description |
33 µF 10 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,746 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UWJ |
| Manufacturer | Nichicon |
| Manufacturing Status | End Of Life |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 33 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 5.5 mm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 85°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -40°C - 85°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 61.5 mA @ 10 kHz | Ripple Current Low Frequency | 41 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 5.4 x 5 mm | Surface Mount Land Size | 5.3 x 5.3 mm | ||
| Tolerance | -20%~20% | Voltage | 10 V |
Overview of UWJ1A330MCL1GB – Aluminum Electrolytic Chip Capacitor, 33 µF, 10 V
The UWJ1A330MCL1GB is a surface-mount aluminum electrolytic chip capacitor in the Nichicon UWJ series designed for high-temperature reflow processing and automated assembly. It delivers 33 µF capacitance at 10 V with a compact φ5 × 5.4 mm can-style SMD package, intended for high-density PC board mounting and machine placement.
Key value propositions include AEC-Q200 compliance for automotive applications, a rated lifetime of 2000 hours at 85°C, low leakage current and specified ripple current performance—making it suitable where AEC-qualified SMD electrolytic capacitors are required. Note: the UWJ series datasheet indicates the series is scheduled to be discontinued and not recommended for new designs.
Key Features
- Capacitance & Voltage — 33 µF rated capacitance at 10 V with ±20% tolerance to support DC decoupling and energy storage in compact SMD designs.
- Package & Mounting — Chip-type radial can SMD in a φ5 × 5.4 mm package (surface-mount); supplied in embossed carrier taping compatible with automatic mounting machines.
- Reflow Compatibility — Designed to withstand 260°C peak reflow (recommended: 260°C peak for 5 s; 230°C over 60 s, up to 2 cycles) for modern assembly processes.
- Reliability & Endurance — Load life of 2000 hours at 85°C with specified endurance limits: capacitance change within ±20%, tan δ up to 200% of initial spec, and leakage current not exceeding initial specified value after test.
- Temperature Range — Rated for operation from −40°C to +85°C to match common electronic system environments.
- Electrical Performance — Low-frequency ripple current of 41 mA at 120 Hz and high-frequency ripple current of 61.5 mA at 10 kHz; leakage current specified at 3.3 µA.
- Compliance — RoHS compliant and AEC-Q200 compliant for designs requiring automotive-grade component qualification.
Typical Applications
- Automotive Electronics — For use in automotive electronic modules where AEC-Q200 qualification and SMD packaging are required for assembly and performance.
- High‑Density PCB Assemblies — Suited to compact surface-mount boards that require machine-placed electrolytic capacitors supplied on embossed carrier tape.
- Production Lines with Reflow Soldering — Intended for assemblies using high-temperature reflow profiles (260°C peak) and automatic placement equipment.
Unique Advantages
- AEC-Q200 Qualification: Provides the documented qualification needed for automotive and similarly demanding electronic applications.
- High‑Temperature Reflow Tolerance: Supports 260°C peak reflow profiles, enabling use in modern SMD assembly processes without manual soldering steps.
- Compact SMD Can Package: φ5 × 5.4 mm chip-type can provides a small footprint for high-density designs while retaining electrolytic capacitance values.
- Long Endurance at Elevated Temperature: 2000 hours at 85°C rated life supports sustained operation in elevated-temperature environments.
- Measured Ripple and Low Leakage: Specified ripple currents at 120 Hz and 10 kHz plus low leakage current (3.3 µA) enable predictable performance in power-filtering roles.
- Automated Assembly Ready: Embossed carrier taping and chip-type SMD format facilitate efficient pick-and-place production flow.
Why Choose UWJ1A330MCL1GB?
UWJ1A330MCL1GB combines AEC-Q200 qualification, a compact chip-style SMD package, and defined reflow compatibility to meet the needs of automotive and industrial assemblies that require automotive-grade electrolytic capacitance in surface-mount form. Its specified endurance (2000 hours at 85°C), low leakage, and ripple current ratings provide predictable electrical behavior for engineered designs.
This part is suited for engineers and procurement teams sourcing AEC-qualified SMD electrolytic capacitors for existing production processes that use high-temperature reflow and automated placement. The combination of compliance, packaged form, and documented specifications supports reliable integration into controlled manufacturing environments.
To request a quote or check availability for UWJ1A330MCL1GB, please contact sales or submit a quote request with your quantity and delivery requirements.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016